The IEEE Electronics System-Integration Technology Conference (IEEE ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is held biennially in Europe. It is sponsored by IEEE-EPS and co-sponsored by IMAPS Europe. The 11th IEEE ESTC will be taking place in Helsinki, the capital of Finland.
The IEEE ESTC 2026 seeks original, noncommercial papers describing research and innovations in all areas of electronics packaging and system integration. Authors are invited to submit a 500-wordabstract describing recent work. Abstracts must detail the objectives of the work presented and demonstrate new results.

CONFERENCE TOPICS:
• Advanced Packaging
• Materials for Interconnects and Packaging
• Optoelectronic Systems Packaging
• Assembly and Manufacturing Technologies
• Design Tools and Modeling
• Power Electronics System Packaging
• Advanced Technologies for Emerging Systems
• Reliability of Electronic Devices and Systems
• Flexible, Printed and Hybrid Electronics
• RF, mm-wave and THz Systems Packaging

The technical program will include oral talks, poster presentations, an exhibition, special sessions and invited keynote talks given by renowned speakers.