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EENM 2026 : 2026 2nd International Conference on Electrical and Electronics and New Materials | |||||||||||||
| Link: https://ais.cn/u/a2AzAz | |||||||||||||
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Call For Papers | |||||||||||||
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2026 2nd International Conference on Electrical and Electronics and New Materials (EENM 2026) will be held from June 12 to 14, 2026, in Tianjin, China.
๐๐ผ๐ป๐ณ๐ฒ๐ฟ๐ฒ๐ป๐ฐ๐ฒ ๐ช๐ฒ๐ฏ๐๐ถ๐๐ฒ: https://ais.cn/u/a2AzAz ---๐๐ฎ๐น๐น ๐๐ผ๐ฟ ๐ฃ๐ฎ๐ฝ๐ฒ๐ฟ๐--- The topics of interest for submission include, but are not limited to: โ Electrical and Electronics ยท Power electronic devices and system design ยท Renewable energy and power grid integration technology ยท Next generation semiconductor devices and processes ยท Microelectronics and nanoelectronics ยท Design and application of high voltage electrical equipment ยท Diagnosis and monitoring technology of electrical equipment ยท Embedded Control and Intelligent Electronic Systems ยท Internet of things equipment and communication technology ยท Photoelectric detection and display technology ยท Wireless Sensor Networks and Low Power Communication ยท Electrical Innovation in Avionics ยท Industrial Automation and Process Control ยท Digital Signal Processing and Applications ยท Optimization and scheduling of power system ยท RF Devices and Their Applications ยท Electromagnetic compatibility and interference ยท Network security in power system ยท Information security and electronic protection technology ยท Electrical equipment and high voltage technology ยท Smart Grid Technology ยท RF technology ยท Electromagnetic compatibility technology ยท Digital signal processing โ New Materials ยท Magnetoresistive conductor and its storage applications ยท Material innovation in smart power systems ยท New semiconductor materials and devices ยท Applications of graphene and two-dimensional materials in electronic devices ยท Innovation and development of photovoltaic materials ยท Nanoelectronics and Nanomaterial ยท Application of Nanomaterials in Electromagnetic Interference Shielding ยท Environmentally friendly electronic materials ยท Material Innovation in Smart Sensors ยท New Developments in Flexible Electronic Materials ยท Research and development of high performance magnetic materials ยท Application of degradable materials in electronic equipment ยท High power electronic equipment material innovation ยท Material Technology of MEMS Sensors ยท Challenges of high-performance MEMS materials ยท Advanced thermal interface materials for electronic devices ยท Thermal Management of Electronic Materials ยท Advanced Electrical Equipment and New Material Applications ยท Material process and optimization ยท Magnetic materials ยท Composite materials ยท Stretchable electronic materials ---๐ฆ๐ฝ๐ฒ๐ฎ๐ธ๐ฒ๐ฟ๐--- Prof. John Wang,National University of Singapore ---๐ฃ๐๐ฏ๐น๐ถ๐ฐ๐ฎ๐๐ถ๐ผ๐ป--- All papers submitted to EENM2026 will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing. ---๐๐บ๐ฝ๐ผ๐ฟ๐๐ฎ๐ป๐ ๐๐ฎ๐๐ฒ๐--- Full Paper Submission Date: April 1, 2026 Notification Deadline:May 1, 2026 Registration Deadline: May 12, 2026 Final Paper Submission Date: May 12, 2026 Conference Dates: July 12-14, 2026 --- ๐ฃ๐ฎ๐ฝ๐ฒ๐ฟ ๐ฆ๐๐ฏ๐บ๐ถ๐๐๐ถ๐ผ๐ป--- Please send the full paper(word+pdf) to Submission System: https://ais.cn/u/a2AzAz |
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