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IEEE-EMIE 2025 : 2025 5th International Conference on Electronic Materials and Information Engineering-IEEE Xplore/EI/Scopus

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Link: https://ais.cn/u/jaUJ7n
 
When Sep 12, 2025 - Sep 14, 2025
Where Harbin, China
Submission Deadline Sep 5, 2025
Final Version Due Sep 10, 2025
Categories    electronics   communications   artificial intelligence   intelligent systems
 

Call For Papers

IEEE 2025 5th International Conference on Electronic Materials and Information Engineering (EMIE 2025) will be held in Harbin, China from September 12 to 14, 2025.

𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗪𝗲𝗯𝘀𝗶𝘁𝗲:https://ais.cn/u/jaUJ7n

---𝗖𝗮𝗹𝗹 𝗙𝗼𝗿 𝗣𝗮𝗽𝗲𝗿𝘀---
The topics of interest for submission include, but are not limited to:
◕ Electronic materials
Physical chemistry
Semiconductor material
Conductive metals and their alloys
Electromagnetic shielding material
Dielectric material
Piezoelectric and ferroelectric materials
Magnetic material
Optoelectronic material
Integrated circuit

◕ Information engineering:
Electronic science and technology
Information and communication Engineering
Optoelectronic information science and technology
Engineering optics
Information optics
Electronic technology
Photoelectric technology
Communication technology
Measurement and control technology
Computer application technology

---𝗦𝗽𝗲𝗮𝗸𝗲𝗿---
Prof. Wenjie Feng,South China University of Technology, China
Prof. Yun Wang,Samueli School of Engineering, University of California, Irvine

---𝗣𝘂𝗯𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻---
All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers will be submitted to IEEE (ISBN: 979-8-3315-5771-3) for publication, and it will be submitted to IEEE Xplore, EI Compendex and Scopus for indexing.

---𝗜𝗺𝗽𝗼𝗿𝘁𝗮𝗻𝘁 𝗗𝗮𝘁𝗲𝘀---
Full Paper Submission Date: September 5, 2025
Registration Deadline: September 7, 2025
Final Paper Submission Date: September 10, 2025
Conference Dates: September 12-14, 2025

--- 𝗣𝗮𝗽𝗲𝗿 𝗦𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻---
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/jaUJ7n

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