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TecPsy 2023 : International Symposium on Technikpsychologie

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Link: https://www.arbing.psychologie.tu-darmstadt.de/symposium
 
When Feb 15, 2023 - Feb 15, 2023
Where Darmstadt
Submission Deadline Sep 2, 2022
Notification Due Nov 2, 2022
Final Version Due Nov 30, 2022
Categories    psychology   HCI   IOT   human factors
 

Call For Papers

We like to invite you to submit a contribution to and participate in the International Symposium on Technikpsychologie – celebrating 100 years of interdisciplinary research at TU Darmstadt!

Industry 1.0, the introduction of mass production, started around 1800 and lasted about one century. The following Industry 2.0 introduced production lines and piece-rate work. Psychological and socio-technical problems were observed and systematically studied in the 1920s. 1922, the “Institut für Psychotechnik” was founded in Darmstadt, Germany. Its scope was the interaction of humans in socio-technical work systems. Human factors were identified as important for the individual worker already at that time. Since Industry 3.0, the introduction of the first functional computers in the 1940s, they become increasingly relevant for all of us. Industry 4.0 is characterized by fully automatized productions, supply chains, and mobility processes in the IoT “Internet of Things”, for example, smart homes with their privacy, safety, and security problems. Industry 5.0 develops increasingly effective and satisfying direct human-robot-interactions, artificial intelligence, and machine learning. Finally, technology is networking our lives completely, private and at work.

On the basis of this history, the conference is an outstanding opportunity to present interdisciplinary research and development activities across departments of engineering and natural sciences as well as human and social sciences. Especially contributions about the current mega trends Digitalization, eHealth, eMobility, Human Centred Design and Interaction HCI, Privacy, Safety, Security, Smart Cities, Smart Living, Sustainability are welcome. This interdisciplinary symposium thus seeks submissions from a wide range of disciplines (psychology, engineering, computer science, architecture, design, HCI, law, economics, sociology, philosophy, ethics, medicine, ergonomics, governance and many more) that cover the various aspects of “Technikpsychologie”.

Topics of interest include, but are not limited to psychological aspects of:

Smart Living & Smart Cities
Driving, Smart Cars, Motorbikes & E-Bikes
Internet of Things
Ambulatory Monitoring
Locomotion Assistance
Resilience Engineering
Aviation
Augmented Reality
Virtual Reality
Human-Robot-Interaction
Usable Security & Usable Privacy
Explainable AI
Technology Education
Ethical Aspects of Technology
Legal Aspects of Technology

---Important Dates---

Submission Deadline: September 2, 2022

Author Notification: November 2, 2022

Proceedings Version: November 30, 2022

Symposium Main Track: February 15, 2023

Symposium Workshops: February 14 & February 16, 2023

---Submission Guidelines---

We are currently implementing the submission system and will publish the link as soon as it is available.

All submissions should contain original work and be written in English. We especially encourage submissions describing empirical studies, literature analyses, and submissions that provide an overview of the state of the art of a research field. Submissions should not, wholly or in part, be under consideration at other venues (conferences, journals, etc.) at the time of submission to TecPsy 2023.

The submissions are subject to a double-blind peer-review process and must therefore be anonymized. This means, all author information and potentially identifying information should be removed from the submission. Own previous work should only be blinded if absolutely necessary and otherwise be referred to in the third person.

Please use the following templates (Overleaf or Word) with references according to the APA format for your submission:

- Word: https://www.arbing.psychologie.tu-darmstadt.de/media/ag_arbeits_und_ingenieurpsychologie/symposium/TecPsy_Template.docx

- Overleaf: https://www.arbing.psychologie.tu-darmstadt.de/media/ag_arbeits_und_ingenieurpsychologie/symposium/PsyTec_Article_Template.zip

- Open template in Overleaf: https://www.overleaf.com/project/new/template/24272?id=100580756&latexEngine=pdflatex&mainFile=main.tex&templateName=PsyTec+Article+Template&texImage=texlive-full%3A2021.1

The submissions should not exceed 20 pages excluding well-marked references and appendices limited to 8 pages. Please ensure that your submission is a PDF file generated using the template available at https://www.arbing.psychologie.tu-darmstadt.de/symposium. Reviewers are not required to read the appendices; hence these should only provide additional supporting information.

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