posted by user: avadhutsardeshmukh || 1375 views || tracked by 4 users: [display]

MLMS 2022 : First Workshop on Machine Learning for Materials Science at KDD 2022

FacebookTwitterLinkedInGoogle

Link: https://demos.rni.tcsapps.com/mlms-2022
 
When Aug 15, 2022 - Aug 15, 2022
Where Washington DC
Submission Deadline May 26, 2022
Notification Due Jun 20, 2022
Final Version Due Jun 27, 2022
Categories    applied machine learning   materials informatics   microstructure informatics   machine learning
 

Call For Papers

We invite original research papers on leveraging machine learning for materials science and engineering problems. Works on combining physics knowledge with artificial intelligence/machine learning algorithms are highly encouraged. Topics of interest include, but are not limited to, the following:

- AI/ML frameworks for process-structure-property correlations modelling
- Incorporating physics domain knowledge into deep neural networks
- Discovery of physically interpretable laws from data
- AI/ML techniques for learning and interpretation from material microstructure images
- Materials Datasets (works describing materials data sets with well-curated meta-data, e.g., microstructure images with processing, composition and properties data)

Related Resources

DSIT 2024   2024 7th International Conference on Data Science and Information Technology (DSIT 2024)
ECAI 2024   27th European Conference on Artificial Intelligence
ICMLA 2024   23rd International Conference on Machine Learning and Applications
KDD 2024   30th ACM SIGKDD Conference on Knowledge Discovery and Data Mining
AIM@EPIA 2024   Artificial Intelligence in Medicine
MLNLP 2024   2024 7th International Conference on Machine Learning and Natural Language Processing (MLNLP 2024)
ICDM 2024   IEEE International Conference on Data Mining
CCBDIOT 2024   2024 3rd International Conference on Computing, Big Data and Internet of Things (CCBDIOT 2024)
AMLDS 2025   2025 International Conference on Advanced Machine Learning and Data Science
IEEE ICA 2022   The 6th IEEE International Conference on Agents