posted by user: sreda || 4693 views || tracked by 10 users: [display]

TEMM 2011 : IEEE Workshop on Thermal Modeling and Management: Chips to Data Centers

FacebookTwitterLinkedInGoogle

Link: http://www.bu.edu/peaclab/temm11/
 
When Jul 25, 2011 - Jul 25, 2011
Where Orlando, FL
Submission Deadline Apr 25, 2011
Notification Due May 25, 2011
Final Version Due Jun 6, 2011
Categories    circuits   VLSI   chips   computing
 

Call For Papers

The First International IEEE Workshop on Thermal Modeling and Management: Chips to Data Centers
Call for Papers
http://www.bu.edu/peaclab/temm11/

High power densities and operating temperatures in multiprocessor systems impose a number of undesirable effects: performance degradation, reliability deterioration, high-energy costs, and physical damage leading to system failures. Recent research has shown that adverse effects of temperature can be modulated by efficient thermal monitoring, dynamic thermal management, thermally-aware architectures, temperature-aware compilation, hybrid computing fabrics, or by novel cooling technologies. Hardware and software design and runtime management methods, spanning from chips to datacenters, play an integral role in the overall thermal behavior and cooling costs. ITRS projects "Temperature Aware Design" as one of the cross-cutting design challenges for future manycore systems.

The main goal of this workshop is to provide a forum for the researchers to share the most recent developments and ideas on thermal modeling and management in various layers of system design and management: hardware design, algorithms, applications and software, operating systems, middleware, and datacenter-level solutions. The topics of interest include, but are not limited to:


* Thermal Modeling of Manycore / 3D Systems
* Thermal Analysis of Computing and Communication Layers
* Temperature Sensor Placement Algorithms
* Thermally-Aware Design Flows
* Thermal Management at Various Abstractions
* Interconnect / TSV Role in Thermal Optimizations
* Thermal Modeling of Large Scale Distributed Embedded Systems
* Thermally-Aware Distributed Computing
* Context-aware Thermal Management
* Thermal Footprint of Datacenters
* Physically Aware 3D Thermal Management
* Electro-Mechanically Aware Thermal Models
* Network Infrastructures for Enhanced Thermal Management
* Thermally-Aware Embedded Computing Applications
* Co-optimization of Cooling Energy and Computation/ Communication Energy
* Variation Aware Thermal Management in Manycore / 3D Systems
* Thermal Modeling and Management in Emerging Technologies
* Cooling Mechanisms and Technologies in 2-1/2 D, 3D, Hybrid Cores


Submission Guidelines: Prospective authors are invited to submit papers not exceeding 6 pages (4~6 pages) in length in standard IEEE two-column format for regular sessions. The IEEE template can be downloaded at: http://www.ieee.org/conferences_events/conferences/publishing/templates.html. Prospective authors should submit an electronic copy of their completed manuscript through the EasyChair portal at:https://www.easychair.org/conferences/?conf=temm2011. Selected papers from the TEMM workshop will be invited to submit as full-length papers in the special edition for Journal of Sustainable Computing: http://ees.elsevier.com/suscom/.


The submission and acceptance timeline is given below.

Paper submission date: April 25 2011

Notification date: May 25 2011

Camera Ready papers: June 6 2011


Registration: All participants will be required to register for the IGCC'11 conference (http://www.green-conf.org). The registration includes access to the workshop. For any questions related to the workshop, please contactqqiu@binghamton.edu.

**

Workshop Co-Chairs:

Dhireesha Kudithipudi, Rochester Institute of Technology, USA
Qinru Qiu, Binghamton University, USA
Ayse Kivilcim Coskun, Boston University, USA

Publicity Chair:

Sherief Reda, Brown University, USA

Technical Program Committee:

David Atienza, EPFL, Switzerland
Jose Ayala, Compultense Univ. of Madrid, Spain
Tianzhou Chen, Zhejiang University, China
Siddharth Garg, University of Waterloo, Canada
Kartik Gopalan, Binghamton University, USA
Omer Khan, MIT, USA
Eren Kursun, IBM T.J. Watson Research Center, USA
Byeong Lee, Univ. of Texas San Antonio, USA
Gang Quan, Florida International University, USAÊ
Emre Salman, Stony Brook University, USA
Mircea Stan, University of Virginia, USA

Related Resources

SMACD 2021   International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design
IARCE 2021-Ei Compendex & Scopus 2021   2021 5th International Conference on Industrial Automation, Robotics and Control Engineering (IARCE 2021)
ADRW 2021   «Archives during rebellions and wars». From the age of Napoleon to the cyber war era
ACM--ICMLSC--EI Compendex, Scopus 2021   ACM--2021 The 5th International Conference on Machine Learning and Soft Computing (ICMLSC 2021)--EI Compendex, Scopus
NOCS 2020   Networks-on-Chips
ACM-ACAI 2020-Ei/Scopus 2020   2020 3rd International Conference on Algorithms, Computing and Artificial Intelligence (ACAI 2020)
ICFSP--IEEE, Ei, Scopus 2021   IEEE--2021 6th International Conference on Frontiers of Signal Processing (ICFSP 2021)--Ei Compendex, Scopus
ACM--ICMVA--EI Compendex, Scopus 2021   ACM--2021 The 4th International Conference on Machine Vision and Applications (ICMVA 2021)--EI Compendex, Scopus
CCNC 2021   IEEE Consumer Communications & Networking Conference
ICCIS--IEEE, Ei and Scopus 2021   IEEE--2021 5th International Conference on Communication and Information Systems (ICCIS 2020)--Ei Compendex, Scopus