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RFIT 2022 : 2022 IEEE International Symposium on Radio-Frequency Integration Technology

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Link: http://www.RFIT2022.org
 
When Aug 29, 2022 - Aug 31, 2022
Where Busan
Submission Deadline Apr 4, 2022
Notification Due May 20, 2022
Final Version Due Jun 20, 2022
Categories    radio-frequency   ICS   antenna   millimeter-wave
 

Call For Papers

We call for high-quality papers containing the latest results in RF integration technology, along with novelty, originality, and key findings. Accepted papers will be published in the conference proceedings and IEEE Xplore Digital Library. To encourage timely reporting of the latest results and have better opportunities to expand papers for possible journal publications, prospective authors are invited to submit a 2- or 3-page manuscript. For more submission details, please visit the website, www.rfit2022.org. The topics of interest are listed below but not limited to the following technical areas.

• Device Technologies
CMOS, SOI, LDMOS, SiGe, GaAs, InP, GaN,
MEMS, reliability, characterization
• Modeling and CAD
active/passive device modeling, CAD, EM
simulation, co-simulation, AI techniques for
modeling and simulation
• Packaging Technology
MCM, SiP, TSV, flip-chip assembly, wire
bonding, anisotropic conductive film
• Passive Circuits and Antenna
on-chip antennas, integrated passive devices,
ferrite, piezoelectric material
• Frequency Generation and Conversion ICs
VCOs, PLLs, synthesizers, ADPLLs, frequency
dividers/multipliers, mixers
• Front-end RFICs
LNAs, VGAs, phase shifters, RF switches
• Power ICs
power amplifiers, linearization circuits, drivers
• Millimeter-wave and THz ICs
circuits operating at mm-wave (30-300 GHz)
and sub-mm-wave ()300 GHz) bands
• Analog and Mixed-Signal ICs
ADCs, DACs, comparators, filters, VGAs, AGC
• High-Speed Data Transceivers
wireless/wireline/optical transceivers, CDRs for
high-speed data links
• Power Transmission ICs
RFIDs, electric coupling, electromagnetic
induction, magnetic resonance, wireless power
transmission ICs
• Emerging ICs
power management, digital RF circuits/
architectures, RF BIST, reconfigurable and
tunable ICs, automotive ICs, AI/ML-assisted
communication ICs, quantum-computing ICs
• Radio-Integrated Systems
IoT/ M2M, automotive radars, wearable
devices, security, biomedical and healthcare
applications
• 5G/B5G/6G Systems
MIMO systems, smart radio systems, cube
satellite and satellite communication systems

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