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SCIE/EI/SCOPUS Journals 2022 : Call for Papers: Sensors/Engineering/Big Data/AI

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When Jan 1, 2022 - Dec 30, 2022
Where Shanghai
Submission Deadline TBD
Categories    AI   data   electrical engineering   big data
 

Call For Papers

Journal 1:
Name: MDPI Sensors(ISSN: 1424-8220)
Web: https://www.mdpi.com/journal/sensors

Special Issue Name: Advanced Machine Learning Tools and Methods for IoMT Sensor Applications
Web: https://www.mdpi.com/journal/sensors/special_issues/AMLTMIoMTSA

Submission Deadline: 20 March 2022.
IF: 3.576
Indexing: Scopus, Ei Compendex, SCIE, Inspec, etc.

Contributions to this Special Issue pertaining—but not limited—to the following are welcome:
• IoMT sensors and architectures;
• IoMT-based e-Health services and applications;
• Cloud and edge computing for IoMT-based e-Health;
• Innovative IoMT devices, instruments, and systems;
• Data stream mining for IoMT-based e-Health;
• Data analytics for IoMT-based e-Health;
• Machine learning and AI for IoMT-based e-Health;
• Ambient assisted living with IoMT;
• Human activity recognition with IoMT;
• IoMT for lifestyle, fitness monitoring, and rehabilitation;
• IoMT for pandemic and epidemiological solutions;
• IoMT decision support systems;
• IoMT data fusion.


Journal 2:
Name: Mathematical Biosciences and Engineering (ISSN: 1551-0018)
Web: https://www.aimspress.com/journal/mbe

Special Issue Name: Medical e-Diagnosis by Fusing Deep Learning and Big Data Analytics
Web: https://www.aimspress.com/mbe/article/6041/special-articles

Submission Deadline: 30 Dec. 2021.
IF: 2.08
Indexing: Scopus, Ei Compendex, SCIE, Inspec, etc.

The topics of interest include, but are not limited to the following:
• Hybrid e-diagnosis, models, solution, and techniques
• Optimized AI-based medical e-diagnosis
• Optimized AI-based IoMT systems for healthcare
• Optimized AI-based deep learning systems for healthcare
• Innovative frameworks of deep learning and big data for e-diagnosis
• Optimized machine learning based algorithms
• Optimized pattern recognition-based systems
• Biomedical signal measurement/sensing and big data processing systems
• AI-driven rehabilitation and assistive robotic systems with big data
• Intelligent medical e-diagnosis driven system: present and future


Journal 3:
Name: Computers & Electrical Engineering (CAEE) (ISSN: 0045-7906)
Web: https://www.journals.elsevier.com/computers-and-electrical-engineering

Special Issue Name: Artificial Intelligence for Smart Image Recognition and Analysis based on 3D Deep Learning and Fuzzy Logic (VSI-sira)
Web: https://www.journals.elsevier.com/computers-and-electrical-engineering/call-for-papers/artificial-intelligence-vsi-sira

Submission Deadline: 1 Jan. 2022.
IF: 3.818
Indexing: Scopus, SCIE, Inspec, etc.

Contact
Yury Yu
Email:paper@hysdces.com
Phone:19136072802

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