ICMEM--Ei, Scopus 2022 : 2022 6th International Conference on Material Engineering and Manufacturing (ICMEM 2022)--EI Compendex, Scopus
Call For Papers
Full Name: 2022 6th International Conference on Material Engineering and Manufacturing (ICMEM 2022)--EI Compendex, Scopus
Abbreviation: ICMEM 2022
**Event: The 6th International Conference on Material Engineering and Manufacturing - 【Quite Stable Publication: Materials Science Forum】 - 【Quick and Stable Index: Ei Compendex, Scopus】
**Venue: Chiba University, Chiba, Japan
**Date: April 15-18, 2022
This year, ICMEM 2021 was held virtually during April 16-19, 2021. Even though it's online conference, with all committees and participants' continuous and generous support and understanding, ICMEM2021 was a complete success again. Thanks again for all of your contribution and preference to our ICMEM conference. Hope you had a very nice time in period of conference.
***The 6th International Conference on Material Engineering and Manufacturing (ICMEM 2022) will be held in Chiba University, Chiba, Japan during April 15-18, 2022. Chiba University was founded in 1949. To learn more details about it, please go to: http://www.chiba-u.ac.jp/e/
*** ICMEM conference has been successfully held in past five years. Participants had wonderful experience. And some authors attended ICMEM conference all the time and witnessed the growth of ICMEM.
*** Each year, the publication and index history were very good. ICMEM conference owns very stable publication and index(Ei Compendex, Scopus). The accepted and registered papers of ICMEM2020, ICMEM 2019 & ICMEM 2018 were published into the Materials Science Forum(MSF) that was Indexed by Ei Compendex & Scopus. And ICMEM 2017 papers were published in IOP Conference Series that also was Indexed by Ei Compendex & Scopus.
Besides, ICMEM2020 papers was published into Materials Science Forum within 4 and a half months and it was indexed only about 1 months after publication.
To get more details about conference, publication and index history, please visit: http://www.icmem.org/book.html
We welcome you to submit your paper and abstract to our ICMEM 2022. April is a quite beautiful month, the cherry blossoms any corner in Japan. Hope we could get together to make exchange academics and enjoy the beautiful cherry blossom rather than just let it blooms lonely, etc!
***Publication*** - 【Stable Publication-Materials Science Forum】【Quick Index-Ei Compendex & Scopus】
The registered and presented papers will be published into 【Materials Science Forum (ISSN print 0255-5476 / ISSN web 1662- 9752)】, which is indexed by Ei Compendex, Scopus.
And you can learn more details about Materials Science Forum via: https://www.scientific.net/MSF
ICMEM 2021 - Will be published in Solid State Phenomena(SSP)【ISBN: 978-3-0357-1859-1】.【under publication】- Received first feedback within 1 month.
ICMEM 2020 - Published in Vol. 1009 - Materials Science Forum. Indexed by Ei Compendex & Scopus! 【Publication is within 4 and a half months. Index is about 1 months after publication.】
ICMEM 2019 - Published in Vol. 976 - Materials Science Forum. Indexed by Ei Compendex & Scopus!
ICMEM 2018 - Published in Vol. 932 - Materials Science Forum. Indexed by Ei Compendex & Scopus!
ICMEM 2017 - Published in Vol. 265 - IOP Conference Series: Materials Science and Engineering. Indexed by Ei Compendex & Scopus!
To learn more details about ICMEM publication history, please visit: http://www.icmem.org/book.html
●Advanced Design Technology
●Materials Science and Engineering
●Advanced Manufacturing Technology
●Manufacturing Systems and Equipment
●Automation, Control and Information Technology
●Industrial Automation and Process Control
●Virtual Instrumentation in Automation
●Machine Vision system
●Metamaterials and Metasurfaces
●Hypersurfaces and their applications
●Industrial Robots and Automation
***To get more topics, please go to: http://www.icmem.org/cfp.html
1. Submission Type:
Full paper (Presentation & Publication) ( no less than 6 pages)
Abstract (Presentation Only)
2. Submission Method:
Please send your full paper or abstract to Online Submission System: http://confsys.iconf.org/submission/icmem2022
Or you can directly send it to email: email@example.com
To get more details, please visit: http://www.icmem.org/sub.html
Prof. Takashige Omatsu, from Chiba University, Japan
>>>Takashige Omatsu (B.S. (1983), Ph.D. (1992) from the University of Tokyo) is a professor of nano-science division of a faculty of engineering in Chiba University.
He has already published >100 refereed journal articles, and he has performed >20 invited presentations of major international conferences.
Prof. Hongqi Sun, from Edith Cowan University, Australia
>>>Dr. Sun became a Full Professor of Chemical Engineering at ECU in November 2017.
He has published over 160 refereed journal papers and received over 8200 citations and achieved an h-index of 55 (Data from Google Scholar in October 2018). He has also secured over three million dollars funding including three ARC discovery projects, four CRC projects and two fellowships.
Assoc. Prof. Masahiro Nomura, from The University of Tokyo, Japan
>>>Masahiro Nomura is an Associate Professor in Institute of Industrial Science, The University of Tokyo. His current research interests include hybrid quantum science, physics and controlling technology of phonon/heat transport in semiconductor nanostructures, and energy harvesting by thermoelectrics.
He is a recipient of The Young Scientists’ Prize by the Minister of Education, Culture, Sports, Science and Technology (2012), ISCS Young Scientist Award (2017), German Innovation Award – Gottfried Wagener Prize (2018), Japan Society for the Promotion of Science Prize (2019), and eleven other awards.
To get more details, please go to: http://www.icmem.org/speaker.html
April 15, 2022 | Friday --- Reception & Conference Materials Collection
April 16, 2022 | Saturday---Opening Remarks, Keynote Speeches and Parallel Sessions
April 17, 2022 | Sunday---Plenary & Invited Speeches, Parallel Sessions, Closing Remarks
April 18, 2022 | Monday---Academic Visit
Ms. Jane Li