IPDPS 2022 : International Parallel and Distributed Processing Symposium
Conference Series : International Parallel and Distributed Processing Symposium
Call For Papers
IPDPS 2022 Call for Papers
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36th IEEE International Parallel &
Distributed Processing Symposium
May 30 – June 3, 2022
Ecole Normale Supérieure de Lyon
Authors are invited to submit manuscripts that present original unpublished research in all areas of parallel and distributed processing. Work focusing on emerging technologies and interdisciplinary work covering multiple IPDPS focus areas is especially welcome. Topics of interest include but are not limited to the following topic areas:
Algorithms: Parallel and distributed computing theory and algorithms. Design and analysis of novel numerical and combinatorial parallel algorithms; reputation and incentive compatible design for distributed protocols and for distributed resource management; communication and synchronization on parallel and distributed systems; parallel algorithms handling power, mobility, and resilience; algorithms for cloud computing; algorithms for edge and fog computing; machine learning algorithms; domain-specific parallel and distributed algorithms; randomization in distributed algorithms and block-chain protocols.
Experiments: Experiments and practice in parallel and distributed computing. Design and experimental evaluation of applications of parallel and distributed computing in simulation and analysis; experiments on the use of novel commercial or research architectures, accelerators, neuromorphic and quantum architectures, and other non-traditional systems; performance modeling and analysis of parallel and distributed systems; innovations made in support of large-scale infrastructures and facilities; methods for and experiences allocating and managing system and facility resources.
Programming Models & Compilers: Programming models, compilers and runtimes for parallel and distributed applications and systems. Parallel programming paradigms, models and languages; compilers, runtime systems, programming environments and tools for the support of parallel programming; parallel software development and productivity.
System Software: System software and middleware for parallel and distributed systems. System software support for scientific workflows (including in-situ workflows); storage and I/O systems; system software for resource management, job scheduling, and energy-efficiency; frameworks targeting cloud and distributed systems; system software support for accelerators and heterogeneous HPC computing systems; interactions between the OS, runtime, compiler, middleware, and tools; system software support for fault tolerance and resilience; containers and virtual machines; system software supporting data management, scalable data analytics, machine learning, and deep learning; specialized operating systems and runtime systems for high performance computing and exascale systems; system software for future novel computing platforms including quantum, neuromorphic, and bio-inspired computing.
Architecture: Architectures for instruction-level and thread-level parallelism; manycore, multicores, accelerators, domain-specific and special-purpose architectures, reconfigurable architectures; memory technologies and hierarchies; volatile and non-volatile emerging memory technologies, solid-state devices; exascale system designs; data center and warehouse-scale architectures; novel big data architectures; network and interconnect architectures; emerging technologies for interconnects; parallel I/O and storage systems; power-efficient and green computing systems; resilience, security, and dependable architectures; performance modeling and evaluation; emerging trends for computing, machine learning, approximate computing, quantum computing, neuromorphic computing and analog computing.
Multidisciplinary: Papers that cross the boundaries of the tracks listed above and/or address the application of parallel and distributed computing concepts and solutions to other areas of science and engineering are encouraged and can be submitted to the multidisciplinary track. Papers focused on translational research are particularly encouraged. Contributions should either target two or more core areas of parallel and distributed computing, or advance the use of parallel and distributed computing in other areas of science and engineering. During the submission of multidisciplinary papers, authors should indicate the areas of focus of their paper.
IPDPS 2022 POST-PANDEMIC PLANNING
IPDPS 2022 will prepare for the possible scenarios a year from now, including a hybrid format for conducting the conference. Regardless of the form of presentation, in person or virtual, every paper accepted for IPDPS 2022 will be published in the proceedings.
Best Paper Award
The program committee will select the top papers as finalists, and one paper as the winner, for recognition with the Best Paper Award.
WHAT/WHERE TO SUBMIT
Abstracts of at most 500 words must be submitted by October 1, 2021. Manuscripts must be submitted by October 8, 2021; submitted manuscripts may not exceed ten (10) single-spaced double-column pages using 10-point size font on 8.5x11 inch pages (IEEE conference style), including figures, tables, and references. The submitted manuscripts should not include author names and affiliations, as a double-blind review process will be followed. Further Instructions for submission will be posted in September 2021.
The IEEE conference style templates for MS Word and LaTeX provided by IEEE eXpress Conference Publishing are available for download. See the latest versions here.
Files should be submitted by following the instructions at the IPDPS 2022 Submission Site (powered by Linklings). Submission portal will be open by the end of August.
REVIEW OF MANUSCRIPTS
All submitted manuscripts will be reviewed by the Program Committee under a double-blind review process. Submissions will be judged on correctness, originality, technical strength, significance, potential impact, quality of presentation, and interest and relevance to the conference scope. Submitted manuscripts should NOT have appeared in or be under consideration for another conference, workshop or journal.
Authors will have the opportunity to provide feedback on the reviews of their submission before the first round decisions are made.
Questions may be sent to email@example.com. Abstracts are due October 1st, 2021, and full manuscripts must be received by October 8th, 2021. This is a final, hard deadline. To ensure fairness, no extensions will be given.
Preliminary decisions will be sent by December 3rd, 2021, with a decision of either accept, revise, or reject. Authors of “revised” papers will have the opportunity to revise the content according to reviewers’ comments and will submit their final paper (together with a cover letter explaining the changes) by January 5th, 2022. Notification of final decisions will be mailed by January 15th, 2022 and camera-ready papers will be due February 11th, 2022.
2022 IMPORTANT DATES
Abstract submissions: October 1, 2021
Full manuscript submissions (double-blind): October 8, 2021
Author response/rebuttal to reviews: 23-24 November 2021
1st round decisions: 3 December 2021
Revised submissions: 5 January 2022.
Final decisions: 15 January 2022
2022 PROGRAM CHAIRS
Yves Robert, ENS Lyon, France & U of Tennessee Knoxville, USA
Bora Uçar, CNRS, Laboratoire LIP, Lyon, France
Chair: Gagan Agrawal, Augusta University, USA
Vice-chair: Sherry Li, Lawrence Berkeley National Lab., USA,
Chair: Kengo Nakajima, University of Tokyo/RIKEN R-CCS, Japan
Vice-chair: Keita Teranishi, Sandia National Laboratories, USA
Programming Models & Compilers
Chair: Didem Unat, Koç University, Turkey
Vice-chair: Mohamed Wahib, AIST, Japan
Chair: Thomas Herault, University of Tennessee Knoxville, USA
Vice-chair: Ana Gainaru, Oak Ridge National Lab, USA
Chair: Radu Teodorescu, Ohio State University, USA
Vice-chair: Mengjia Yan, MIT, USA
Chair: Alba Cristina Melo, University of Brasilia, Brazil
Vice-chair: Sunita Chandrasekaran, University of Delaware, USA
2022 TECHNICAL PROGRAM COMMITTEE