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RFIT 2011 : IEEE International Symposium on Radio-Frequency Integration Technology


When Nov 30, 2011 - Dec 2, 2011
Where Beijing, China
Submission Deadline Aug 1, 2011
Notification Due Sep 19, 2011
Final Version Due Oct 17, 2011

Call For Papers

Having been successfully held in Singapore since 2005, the RFIT Symposium will start rotating around IEEE Region 10 and will be held in Beijing this year. RFIT is a small yet interdisciplinary forum for microwave and microelectronics technologies. It is co-sponsored by Tsinghua University, the IEEE Microwave Theory and Techniques Society, and the IEEE Solid-State Circuits Chapters in Beijing and Singapore.
RFIT provides a forum for integrated circuit and technology communities to meet and present the latest developments in integrated circuit design, technology and system integration, with emphasis on wireless communication systems and emerging applications such as biology and healthcare. This year’s theme is RF Integration for Health Care and Sustainable Environment.
RFIT will again feature both invited and contributed papers. Distinguished researchers will be invited to deliver keynote speeches and invited talks on technology trends and significant advances. Best papers will be selected from contributed papers for awards. Both invited papers and contributed papers accepted by RFIT will appear in IEEE Xplore and the Engineering Index and extended versions of the papers can be published in a special issue of IEEE Transactions on Microwave Theory and Techniques subject to the normal review procedure.

The topics of interest include, but are not limited to:
(1) Millimeter-wave ICs and systems for data, imaging, security, vehicle, and medical applications
(2) RF transceiver and building blocks (Rx, Tx, LNA, PA, mixer and filter)
(3) Synthesizers (VCO, DCO, PLL and divider)
(4) Analog and mixed-signal circuits and systems
(5) RF device technologies and modeling (Si, SOI, GaAs and GaN)
(6) Low-power wireless data system ICs (Bluetooth, 802.xx, sensors and RFID)
(7) THz and optical sources, ICs and modules
(8) Digitally assisted RFIC, software-defined radios, digital TV tuner ICs, and DDS
(9) Integrated on-chip antennas and passive components
(10) 3D system integration and novel packaging technologies (TSV, SiP and SoP)
(11) MEMS/NEMS cum IC integration
(12) Emerging technologies, circuits and applications (carbone nanotubes, graphene, microphotonics, RF nano-electronics)
(13) Biomedical RF electronics
(14) Wireline communication ICs

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