IOP, EI, Scopus-EMECS 2022 : 2022 International Conference on Electronics, Mechanical Engineering and Computer Science (EMECS 2022)-EI Compendex
Call For Papers
2022 International Conference on Electronics, Mechanical Engineering and Computer Science (EMECS 2022)-EI Compendex
Location: Xiamen, China
Dates: October 21-23, 2022
Conference Format: Online and In-person
2022 International Conference on Electronics, Mechanical Engineering and Computer Science (EMECS 2022) will be held during October 21-23, 2022 in Xiamen, China.
EMECS 2022 is to bring together leading academic scientists, research scholars and researchers to share and exchange their experiences and research results about all aspects of Electronics, Mechanical Engineering and Computer Science. It would also provide a premier interdisciplinary forum for researchers, practitioners and educators to present and discuss the most recent innovations, trends, concerns, practical challenges encountered and the solutions adopted in the field of Electronics, Mechanical Engineering and Computer Science.
Call For Papers:
3D Process and Integration Technologies
Substrate Embedding & Advanced Flip-Chip Packaging
Wafer-Level CSP & Heterogeneous Integration
Design and Analysis of Power Delivery Systems
Optimization of Systems
Renewable and Non-Renewable Energies
Oil and Gas
Wireless and Sensor Devices
Knowledge Discovery and Data Mining
(For more topics: http://www.emecs2022.net/topics.html)
Paper Publication and Indexing:
All registered and presented papers will be published in the volume of conference proceeding, published by Journal of Physics: Conference Series (JPCS), ISSN: 1742-6596, indexed by EI Compendex, Scopus, Conference Proceedings Citation Index—Science (CPCI-S), Chemical Abstracts Service and other related databases.
Paper Submission (ONLY Choose one way to submit your paper):
1. Submission System: https://cmt3.research.microsoft.com/EMECS2022/
2. Email Submission: email@example.com
EMECS 2022 Speakers:
Prof. Mo-Yuen Chow, IEEE Fellow, North Carolina State University, USA
Prof. Miguel Ángel Sotelo, IEEE Fellow, University of Alcalá, Spain
Prof. Zhongsheng Hou, CAA Fellow, IEEE Fellow, Qingdao University, China
Prof. Tan, Ying, Peking University, China
Assist. Prof. Huamin Li, University at Buffalo, USA
You are also welcome to join us as:
As Presenter: If you want to share you latest research results by giving presentation without publish papers, please submit your abstract (300-400 words)
As Listener: You are also warmly welcomed to take part in EMECS 2022 as a listener even though you have no paper to submit.
As Reviewer: To ensure the fairness and guarantee the quality of EMECS 2022, we cordially invite experts and scholars join us as a reviewer.
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