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ITherm 2012 : 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems


When May 30, 2012 - Jun 1, 2012
Where San Diego, USA
Submission Deadline Sep 2, 2011
Notification Due Oct 15, 2011
Final Version Due Mar 7, 2012

Call For Papers

ITherm 2012 ( is the leading international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages, and systems. ITherm 2012 will be held along with the 62nd Electronic Components and Technology Conference (ECTC 2012,, a premier electronic packaging conference, in Las Vegas, Nevada. Based on the success of ITherm 2010, papers will be presented in stand-up and selected topical poster sessions. Poster sessions, which allow a high level of author/audience interaction, will play a major role in this and future ITherm conferences. All papers will be peer reviewed by two or more reviewers, and will be published in the ITherm proceedings. In addition to paper presentations and vendor exhibits, ITherm 2010 will include panel discussions, keynote lectures by prominent speakers, and professional short courses. Original papers are solicited in the general areas of (but not limited to):

Thermal Management:
• Novel Materials: Thermal Vias, Heat Spreaders and Thermal Interface Materials
• Natural and Forced Convection Air Cooling
• Advances in Compact Air Movers
• Single Phase Liquid Cooling
• Novel Phase Change Cooling Techniques: Boiling, Heat Pipes, Thermosyphon, Spray and Jet Impingement
• Microfabricated Thermal Management Devices and Systems
• Sub-Ambient Cooling: Solid State, Vapor Compression, Absorption, Adsorption, Thermo-acoustic, Magnetocaloric
• Thermal Management in Wireless, Networking, Computing, Lighting, Harsh Environments, and Peripheral Hardware.
• Thermal and Energy Management in Data Centers
• Three-Dimensional Electronics
• Advances in Experimental Characterization
• Advances in Computational Characterization: Multi-Scale Modeling, Compact Modeling, Multi-Physics Modeling, Multi-Objective Design
and Optimization

• Modeling and Simulation for Reliability at Package, Board, and System Levels
• Failure Mechanics and Damage Modeling
• Experimental Techniques
• Constitutive Models
• Impact, Drop and Vibrational Analysis of Packages, Sub-Systems, and Systems
• Solder Profile Modeling, Fatigue Mechanics of Packages, Interconnects
• Materials
- Design, Synthesis, and Processing of Materials for Thermal/Thermo-Mechanical Management in Electronic Systems
 - Thermo-mechanical Characterization and Modeling of Packaging Materials
 - Material Interfaces: Engineering, Characterization and Simulation

Emerging Technologies:
• Sensors (Medical, Military, Consumer, Structures, Diagnostic, etc.)
• Nanotechnology: Thermal, Mechanics, Material and Process Related Issues in Nanostructures
• Micro-Fluidics
• Fiber-Optics Interconnect Systems & Free Space Optical Interconnects
• MEMS: Device and Package Level Reliability Issues
• Integrated Biochips and Bioelectronics
• Medical, Telecommunication, and Automotive Systems
• Space Systems: Earth Orbiting and Deep-Space Missions

Panel Discussions:
• Proposals are solicited for panel discussion topics addressing contemporary issues of broad interest to the ITherm community.
These should include a title, an abstract describing the theme(s) to be addressed, and a list of potential panelists.

Abstract and subsequent paper submissions are entirely web-based, with the following deadlines. Please submit a 400 word
text-only (no figures and tables) abstract to ITherm website: The Abstracts will be
considered for oral or poster sessions. The authors will be informed regarding the session format (poster or stand up) at the
time of abstract acceptance.

Some important dates:
• Deadline for Submission of Abstracts September 2, 2011
• Notification of Abstract Acceptance October 15, 2011
• Draft Paper Submission December 14, 2011
• Final Paper Web Submission March 7, 2012

Direct general inquiries to:
General Chair
Dr. Sandeep Tonapi
Anveshak Inc.
732 W. Hemlock Way
Chandler AZ 85248

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