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SIGCOMM 2011 : ACM Special Interest Group on Data Communication

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Conference Series : Conference on Applications, Technologies, Architectures, and Protocols for Computer Communication
 
Link: http://conferences.sigcomm.org/sigcomm/2011/
 
When Aug 15, 2011 - Aug 19, 2011
Where Toronto, Canada
Abstract Registration Due Jan 24, 2011
Submission Deadline Jan 31, 2011
Notification Due May 6, 2011
 

Call For Papers

Preliminary Call for Papers
The SIGCOMM 2011 conference seeks papers describing significant research contributions to the field of computer and data communication networks. We invite submissions on a wide range of networking research, including, but not limited to:
Design, implementation, and analysis of network architectures and algorithms
Economic aspects of the Internet
Enterprise, datacenter, and storage area networks
Experimental results from operational networks or network applications
Fault-tolerance, reliability, and troubleshooting
Insights into network and traffic characteristics
Network management and traffic engineering
Network security, vulnerability, and defenses
Network, transport, and application-layer protocols
Networking issues for emerging applications
Operating system and host support for networking
Peer-to-peer, overlay, and content distribution networks
Resource management, quality of service, and signaling
Routing, switching, and addressing
Technical aspects of online social networks
Techniques for network measurement and simulation
Wireless, mobile, ad-hoc, and sensor networks
Submissions
SIGCOMM is a highly selective conference where full papers typically report novel results firmly substantiated by experimentation, simulation, or analysis. Submissions can be up to 14 pages in length, in two-column 10pt format. Please see the submission instructions for complete details. Note that accepted camera-ready papers will be 12 pages in length, in two-column format with 9pt font.
In addition to the main conference, SIGCOMM 2011 will have a series of co-located workshops, a poster and demo session, a travel grant program, and conference best paper and SIGCOMM awards.

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