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SMT/HYBRID/PACKAGING 2011 : SMT/HYBRID/PACKAGING 2011 - Call for Tutorials

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Link: http://www.smt-exhibition.com
 
When May 3, 2011 - May 5, 2011
Where Nuremberg
Submission Deadline Oct 15, 2010
Notification Due Dec 10, 2010
Final Version Due Mar 18, 2011
Categories    system integration   electronic packaging   electronic assembly   printed circuit boards
 

Call For Papers

Invitation

Parallel to the exhibition, the SMT/HYBRID/PACKAGING conference and tutorials are the most important platform for information and networking in the field of micro electronics manufacturing in Europe.

The practice-oriented tutorials at SMT/HYBRID/PACKAGING offer an ideal platform to share your professional knowledge and solutions with a highly qualified audience. You as an expert will have the opportunity to discuss with colleagues and decision-makers, to make valuable contacts and to impact on the future direction of the industry.

The SMT/HYBRID/PACKAGING committee cordially invites you help shape the program. They are looking forward to receiving your abstract proposal.

Benefits for speakers:

• Unique presentation platform with a highly qualified audience
• Networking opportunities with international experts from industry and science
• Free admission to the SMT exhibition
• Invitation to the Opening Reception (3 May 2011) and to the committee and speaker's
dinner (5 May 2011)
• Publication of your tutorial title in the conference program and exhibition catalogue


Topics:

1. System Integration and Packaging on the basis of Printed Circuit Board Technologies
2. Design of Printed Circuit Boards
3. Pick and Place of Electronic Components
4. Electronic Assembly and Interconnection Technologies
5. PCB Process Technologies
6. Reliability and Manufacturing Quality of Electronic Components and Boards
7. Advanced Materials and their Application
8. Environment & Electronics
9. Manufacturing Logistics and Production Organisation
10. Standardisation
11. Printed Electronics
12. Risk Management
13. Energy Efficiency in Electronics Manufacturing
14. Minimization of Quality Costs
15. Optimization in Logistics Production
16. Enhancement of the Overall Equipment Effectiveness (OEE)
17. 3D Integration Technologies
18. Manufacturing of LED Systems
19. Manufacturing of Power Electronics
20. Application Results in Different Industry Sectors


Please use following link for your submission:
http://www.mesago.de/en/SMT/The_conference/Call_for_Tutorials/index.htm

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