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ICICM--IEEE, Ei & Scopus 2020 : IEEE--2020 The 5th International Conference on Integrated Circuits and Microsystems (ICICM 2020)--Ei Compendex, Scopus, and CPCI | |||||||||||
Link: http://www.icicm.net/ | |||||||||||
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Call For Papers | |||||||||||
ICICM 2020--IEEE Xplore,Ei Compendex and Scopus
IEEE--2020 The 5th International Conference on Integrated Circuits and Microsystems (ICICM 2020)--Ei Compendex, Scopus, and CPCI Time: October 23-25, 2020 Place: Nanjing, China http://www.icicm.net/ ==Publication: All accepted papers after proper presentation and registration will be collected in the IEEE conference proceedings, which will be submitted and reviewed in the IEEE Xplore, Ei Compendex, Scopus, and CPCI (Web of Science) after the conference. ==Submission email:icicm@young.ac.cn (Or you still can submit to the submission system on website) ==Find the tempalte with the link: http://icicm.net/Template.doc (Word) http://icicm.net/WIN-or-MAC-LaTeX2e-Transactions-Style-File.zip (Latex) ★Keynote Speakers Prof. Ljiljana Trajkovic, IEEE Fellow,Simon Fraser University, Canada Prof. Fei Yuan,Ryerson University, Canada ★Invited Speakers Prof. Sheng-Lyang Jang,National Taiwan University of Science and Technology, Taiwan Prof. Dai Yong-Sheng,Nanjing University of science & Technology, China ★ICICM Committees Advisory Chair Prof. Ljiljana Trajkovic, IEEE Fellow, Simon Fraser University, Canada Conference Chairs Prof. Zhigong Wang, Southeast University, China Prof. Li Qiang, University of Electronic Science and Technology of China, China Prof. Gene Eu Jan, National Taipei University, Taiwan Program Chairs Prof. Fei Yuan, Ryerson University, Canada Prof. Zou Zhuo, Fudan University, China Prof. Liu Dake, Beijing Institute of Technology, China | Link?ping University, Sweden Assoc. Prof. Keping Wang, Southeast University, China Steering Committee Chairs Prof. Huang Le Tian, University of Electronic Science and Technology of China, China Prof. Dai Yong-Sheng, Nanjing University of Science & Technology, China Prof. Sheng-Lyang Jang, National Taiwan University of Science and Technology, Taiwan Technical Committee Prof. Xiaoxiao Wang, BeiHang University, China Prof. Bo Yan, University of Electronic Science & Technology of China, China Prof. Dr. Ashutosh Kumar Singh, National Institute of Technology, Kurukshetra, India Assis. Prof. Hossein Fariborzi, King Abdullah University of Science and Technology, Saudi Arabia Assoc. Prof. Hamed Alipour-Banaei, Islamic Azad University, Iran Assoc. Prof. Tiejun Chen, Yiyang Medical College, China Assis. Prof. Weiguang Sheng, Shanghai Jiao Tong University, China Prof. Changchun Zhang, Shanghai University of Posts and Telecommunication / Southeast University, China Assis. Prof. Yu Bai, California State University Fullerton, USA Prof. Jinzhao Wu, Guangxi University for Nationalities, China Prof. Shiwei Feng, Beijing University of Technology, China Assoc. Prof. Wei Ni, Hefei University of Technology, China Prof. Xingyuan Tong, Xi'an University of Posts & Telecommunications,China Prof. Jinyan Wang, Peking University, China Prof. Zhi-Jian Xie, NC A&T State University, USA Prof. S. Ushakumari, College of Engineering Trivandrum, India Prof. Lu Tang, Southeast University, China Prof. Haizhi Song, University of Electronic Science and Technology of China, China Prof. Tang Bin, Chengdu Aeronautic Polytechnic, The Innovation Base of School-Enterprise Cooperation Aviation Electronic Technology in Sichuan, China Prof. Shiwei Feng, Beijing University of Technology,China Assoc.Prof. Quanzhen Duan,Tianjin University of Technology, China Assoc.Prof. Yue Ming Ding,Tianjin University of Technology,China Prof.Shengming Huang,Tianjin University of Technology, China Prof. Fei Yuan, Ryerson University, Canada Assoc. Prof. Guolin Sun, Beihang University, China Assoc. Prof. Yuan-Hao Huang, National Tsing Hua University,Taiwan Asst. Prof. Dr. Najam Muhammad Amin, Bahria University, Pakistan Prof. Dr.Qifeng Xu, Fuzhou University, China For more members, please visit conference website: http://www.icicm.net/committee.html ★History Papers of ICICM2019 can be checked in IEEE Xplore! Electronic ISBN: 978-1-7281-5132-8 | USB ISBN: 978-1-7281-5131-1 Papers of ICICM2018 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus! Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5 Papers of ICICM2017 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus! Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0 Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus! Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3 ★Topics Digital, Analog, Mixed Signal IC and SOC design technology Silicon integrated circuits and manufacturing Low-power, RF devices & circuits IC Computer-Aided –Design technology, DFM Silicon/germanium devices and device physics Interconnect, Low K, High K and other process technologies Unconventional and nano-electronics Organic semiconductor devices and technologies Compound semiconductor devices and circuits Displays, sensors and MEMS Semiconductor materials and material characterization Packaging and testing technology Solar cell & other devices for new energy sources Modeling and simulation Equipment technology Reliability Displays, sensors and MEMS Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.) ★Support 1, Technical Support from IEEE 2, Sponsored by University of Electronic Science and Technology of China and Southeast University, China ★Conference Schedule 1) October 23, 2020—Registration & Material Collecting 2) October 24, 2020—Keynote & Invited Speeches & Papers Presentations 3) October 25, 2020—Papers Presentations ★Conference Contact Ms Daisy Tseng Email: icicm@young.ac.cn Tel: +86-28-87777577 |
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