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CC 2021 : Compiler Construction

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Link: https://conf.researchr.org/home/CC-2021
 
When Feb 27, 2021 - Mar 3, 2021
Where Seoul, Korea
Submission Deadline TBD
 

Call For Papers

Upcoming Important Dates
Sun 8 Nov 2020
CC Research Papers Paper Registration and Abstract Submission
Tue 10 Nov 2020
CC Research Papers Full Paper Submission
Mon 7 - Wed 9 Dec 2020
CC Research Papers Author Response Period
Tue 22 Dec 2020
CC Research Papers Author Notification
Tue 5 Jan 2021
CC Research Artifacts Artifact Submission
Wed 20 Jan 2021
CC Research Artifacts AE Notification
Fri 22 Jan 2021
CC Research Papers Camera-ready Deadline


Mon 3 Aug 2020
COVID-19 Update
CC 2021 along with CGO, HPCA and PPoPP will be held virtually in 2021. More details coming soon.

All News Articles
ACM SIGPLAN 2021 International Conference on Compiler Construction (CC 2021)
The International Conference on Compiler Construction (CC) is interested in work on processing programs in the most general sense: analyzing, transforming or executing input that describes how a system operates, including traditional compiler construction as a special case.

CC 2021 is the 30th edition of the conference and will be co-located with CGO, HPCA and PPoPP.

CC is an ACM SIGPLAN conference and implements guidelines and procedures recommended by SIGPLAN.


Call for Papers
The International Conference on Compiler Construction (CC) is interested in work on processing programs in the most general sense: analyzing, transforming or executing input that describes how a system operates, including traditional compiler construction as a special case.

Original contributions are solicited on the topics of interest which include, but are not limited to:

Compilation and interpretation techniques, including program representation, analysis, and transformation; code generation, optimization, and synthesis; the verification thereof
Run-time techniques, including memory management, virtual machines, and dynamic and just-in-time compilation
Programming tools, including refactoring editors, checkers, verifiers, compilers, debuggers, and profilers
Techniques, ranging from programming languages to micro-architectural support, for specific domains such as secure, parallel, distributed, embedded or mobile environments
Design and implementation of novel language constructs, programming models, and domain-specific languages
CC is an ACM SIGPLAN conference, and implements guidelines and procedures recommended by SIGPLAN.

Prospective authors should be aware of SIGPLAN’s Copyright policies. Proceedings will be made available online in the ACM digital library from one week before to one week after the conference.

Submission Guidelines
Submission URL: https://cc21.hotcrp.com

All submissions must be made electronically through the conference submission website and include an abstract (100–400 words), author contact information, the full list of authors and their affiliations. Full paper submissions must be in PDF formatted printable on both A4 and US letter size paper.

All papers must be prepared in ACM Conference Format using the 2-column acmart format: use the SIGPLAN proceedings template acmart-sigplanproc-template.tex for Latex, and interim-layout.docx for Word. You may also want to consult the official ACM information on the Master Article Template and related tools. Important note: The Word template (interim-layout.docx) on the ACM website uses 9pt font; you need to increase it to 10pt.

Papers should contain a maximum of 10 pages of text (in a typeface no smaller than 10 point) or figures, NOT INCLUDING references. There is no page limit for references and they must include the name of all authors (do not use et al.).

Appendices are not allowed, but the authors may submit anonymous supplementary material, such as proofs, source code, or data sets; all supplementary material must be in PDF or ZIP format. Looking at supplementary material is at the discretion of the reviewers.

Papers may be resubmitted to the submission site multiple times up until the deadline, but the last version submitted before the deadline will be the version reviewed. Papers that exceed the length requirement, that deviate from the expected format, or that are submitted late will be rejected.

CC 2021 will follow ACM’s Copyright Policies. Prospective authors should adhere to SIGPLAN’s Republication Policy and to ACM’s Policy and Procedures on Plagiarism.

Double-blind Reviewing Process
CC 2021 will implement a double-blind reviewing process.

Authors will need to identify any potential conflicts of interest with PC, as defined in the SIGPLAN policy.

To facilitate the double-blind reviewing process, submissions (including supplementary material) should not reveal the identity of the authors in any way. Authors should leave out author names and affiliations from the body of their submission. They should also ensure that any references to authors’ own related work should be in the third person (e.g., not “We build on our previous work …” but rather “We build on the work of …”).

The purpose of this process is to help the PC and external reviewers come to an initial judgment about the paper without bias, not to make it impossible for them to discover the authors if they were to try. Nothing should be done in the name of anonymity that weakens the submission or makes the job of reviewing the paper more difficult. In particular, important background references should not be omitted or anonymized.

In addition, authors should feel free to disseminate their ideas or draft versions of their paper as they normally would. For instance, authors may post drafts of their papers on the web or give talks on their research ideas.

Authors with further questions on double-blind reviewing are encouraged to contact the Program Chairs by email.

Artifact Evaluation
Authors are encouraged to submit their artifacts for the Artifact Evaluation (AE). The Artifact Evaluation process begins after the acceptance notification, and is run by a separate committee whose task is to assess how the artifacts support the work described in the papers.

To ease the organization of the AE committee, we kindly ask authors to indicate at the time they submit the paper, whether they are interested in submitting an artifact.

Papers that go through the Artifact Evaluation process successfully will receive a seal of approval printed on the papers themselves.

Authors of accepted papers are encouraged, but not required, to make these materials publicly available upon publication of the proceedings, by including them as “source materials” in the ACM Digital Library.

Additional information is available on the AE web page.

Information to Authors
Authors of accepted submissions will be required to choose one of the following options:

Author retains copyright of the work and grants ACM a non-exclusive permission-to-publish license (and, optionally, licenses the work with a Creative Commons license;
Author retains copyright of the work and grants ACM an exclusive permission-to-publish license;
Author transfers copyright of the work to ACM.
For more information, please see ACM Copyright Policy and ACM Author Rights.

Related Resources

CC 2020   Compiler Construction
MICRO 2020   International Symposium on Microarchitecture
IEEE-CC 2020   First IEEE International Conference on Conversational Computing
HiPEAC 2020   15th International Conference on High Performance Embedded Architectures and Compilers
TACAS 2021   27th International Conference on Tools and Algorithms for the Construction and Analysis of Systems
MATEC--ICBMC--EI Compendex and Scopus 2021   MATEC--2021 6th International Conference on Building Materials and Construction (ICBMC 2021)--EI Compendex, Scopus
TCAD-SI-CFHH 2021   TCAD Special Issue on Compiler Frameworks and Co-design Methodologies for Heterogeneous Systems-on-Chip
ICAMC--Ei, Scopus 2020   2020 The 6th International Conference on Architecture, Materials and Construction (ICAMC 2020)--Ei Compendex, Scopus
ICBMC--MATEC, EI and Scopus 2021   MATEC--2021 6th International Conference on Building Materials and Construction (ICBMC 2021)--EI Compendex, Scopus
ICAMC--Ei Compendex, Scopus 2020   2020 The 6th International Conference on Architecture, Materials and Construction (ICAMC 2020)--Ei Compendex, Scopus