The 2020 IEEE Global Communications Conference (GLOBECOM) will be held in the lively and picturesque city of Taipei, Taiwan, from 7 to 11 December 2020. Themed “Communications for Human and Machine Intelligence,” this flagship conference of the IEEE Communications Society will feature a comprehensive high-quality technical program including 13 symposia and a variety of tutorials and workshops. IEEE GLOBECOM 2020 will also include an attractive industry program aimed at practitioners, with keynotes and panels from prominent research, industry and government leaders, business and industry panels, and technological exhibits.

All papers for technical symposia (including Selected Areas in Communications) should be submitted via EDAS.

IMPORTANT DATES
Paper Submissions Due: 15 April 2020
Acceptance Notification: 25 July 2020
Camera-Ready: 1 September 2020

Original technical papers are sought in the following areas:

SELECTED AREAS IN COMMUNICATIONS (SAC) SYMPOSIUM
SAC - Access Networks/Systems (CFP)
Ahmed E. Kamal, Iowa State University Ames, USA

SAC - Big Data (CFP)
Jinsong Wu, Guilin University of Electronic Technology, China, and University of Chile, Chile

SAC - Cloud & Fog/Edge Computing, Networking and Storage (CFP)
Bane Vasić, University of Arizona, USA

SAC - e-Health (CFP)
Andrea Sciarrone, University of Genoa, Italy

SAC - Internet of Things & Smart Connected Communities (CFP)
Gianluca Rizzo, University of Applied Sciences of Western Switzerland, Switzerland
Syed A. R. Zaidi, University of Leeds, UK

SAC - Machine Learning for Communications (CFP)
Slawomir Stanczak, Technische Universität Berlin & Fraunhofer HHI, Berlin, Germany

SAC - Molecular, Biological and Multi-Scale Communications (CFP)
Nan Yang, Australian National University, Canberra, Australia

SAC - Satellite and Space Communications (CFP)
Igor Bisio, University of Genoa, Italy

SAC - Smart Grid Communications & Power Line Communications (CFP)
Yang Xiao, The University of Alabama, USA

SAC - Social Networks (CFP)
Eirini Eleni Tsiropoulou, University of New Mexico, USA

SAC - Tactile Internet (CFP)
Oliver Holland, Advanced Wireless Technology Group, Ltd.

Ad-hoc and Sensor Networks Symposium (CFP)
Vojislav Misic, Ryerson University, Canada
Hyunbum Kim, University of North Carolina at Wilmington, USA
Shibo He, Zhejiang University, China

Cognitive Radio and AI-Enabled Networks Symposium (CFP)
Julian Cheng, The University of British Columbia, Canada
Zhijin Qin, Queen Mary University of London, UK

Communication & Information Systems Security Symposium (CFP)
Farid Naït-Abdesselam, University of Missouri Kansas City, USA
Weizhi Meng, Technical University of Denmark, Denmark
Chin-Tser Huang, University of South Carolina, USA

Communication QoS, Reliability & Modeling Symposium (CFP)
Xianbin Wang, Western University, Canada
Hidenori Nakazato, Waseda University, Japan
Melike Erol-Kantarci, University of Ottawa, Canada

Communication Software, Services & Multimedia Apps. Symposium (CFP)
Chonggang Wang, Interdigital, USA
Boucif Amar Bensaber, Université du Québec à Trois-Rivières, Canada

Communication Theory Symposium (CFP)
Marco Chiani, University of Bologna, Italy
Rui Dinis, FCT-UNL, Instituto de Telecomunicações, Portugal
Paschalis Sofotasios, Khalifa University, UAE & Tampere University, Finland

Green Communications Systems and Networks Symposium (CFP)
Daniel K. C. So, The University of Manchester, UK
Yifei Wei, BUPT, China

Mobile and Wireless Networks Symposium (CFP)
Mohamad Assaad, CentraleSupélec, France
Dongmei Zhao, McMaster University, Canada
Ai-Chun Pang, National Taiwan University. Taiwan
Anna Maria Vegni, Roma Tre University, Italy

Next-Generation Networking and Internet Symposium (CFP)
Rami Langar, University Gustave Eiffel, France
Lotfi Mhamdi, Leeds University, UK
Jerzy Domzal, AGH University of Science and Technology, Poland

Optical Networks and Systems Symposium (CFP)
Jiajia Chen, Chalmers University of Technology, Sweden
Abdelmoula Bekkali, TOYO Electric Corporation, Japan

Signal Processing for Communications Symposium (CFP)
Hai Lin, Osaka Prefecture University, Japan
Jemin Lee, DGIST, South Korea
Dania Marabissi, Università degli Studi di Firenze, Italy

Wireless Communications Symposium (CFP)
Lian Zhao, Ryerson University, Canada
Koichi Adachi, The University of Electro-Communications, Japan
Wenchi Cheng, Xidian University, China
Xiangwei Zhou, Louisiana State University, USA
Nicolo Michelusi, Purdue University, USA

Prospective authors are invited to submit original technical papers for presentation and publication. Accepted and presented technical papers will be published in the IEEE GLOBECOM 2020 Conference Proceedings and submitted to IEEE Xplore®.

Please address questions regarding the Technical Symposia to TPC Chair, Li-Chun Wang, and both TPC Co-Chairs, Hsuan-Jung Su and Guoliang Xue. Please address questions regarding a specific symposium or a SAC symposium track to the respective symposium co-chairs or the SAC symposium track chairs listed on the conference website.

Please make sure to follow the Author and Submission Guidelines listed below.

AUTHOR AND SUBMISSION GUIDELINES
Important IEEE Policy Announcement: The IEEE reserves the right to exclude a paper from distribution after the conference (including its removal from IEEE Explore) if the paper is not presented at the conference.

Papers are reviewed on the basis that they do not contain plagiarized material and have not been submitted to any other conference at the same time (double submission). These matters are taken very seriously and the IEEE Communications society will take action against any author who engages in either practice. Follow these links to learn more:

IEEE Policy on Plagiarism
IEEE Policy on Double Submission

PLEASE NOTE: To be published in the IEEE GLOBECOM 2020 Conference Proceedings and to be eligible for publication in IEEE Xplore®, an author of an accepted paper is required to register for the conference at the FULL or LIMITED (member or non-member) rate and the paper must be presented by an author of that paper at the conference unless the TPC Chair grants permission for a substitute presenter in advance of the event and who is qualified both to present and answer questions. Non-refundable registration fees must be paid prior to uploading the final IEEE formatted, publication-ready version of the paper. For authors with multiple accepted papers, one FULL or LIMITED registration is valid for up to 3 papers. Accepted and presented papers will be published in the IEEE GLOBECOM 2020 Conference Proceedings and submitted to IEEE Xplore®.

During the initial paper submission process via EDAS, it is the authors' responsibility to ensure that the author list and the paper title of the submitted pdf file is an exact match to the author list and paper title on the EDAS registration page. In particular, the EDAS registration page must include all co-authors, not just the submitting author. Failure to comply with this rule might result in your paper being withdrawn from the review process. Please be aware that the author list of an accepted paper can NOT be changed in the final manuscript.

IMPORTANT:

The page length limit for all initial submissions for review is SIX (6) printed pages (10-point font) and must be written in English. Initial submissions longer than SIX (6) pages will be rejected without review.

All final submissions of accepted papers must be written in English with a maximum paper length of six (6) printed pages (10-point font) including figures. No more than one (1) additional printed page (10-point font) may be included in final submissions and the extra page (the 7th page) will incur an over length page charge of US$100. All final papers must be submitted to the IEEE Conference eXpress website. Please refer to the acceptance letter for the instructions on how to upload final papers.

Download Standard IEEE conference templates for LaTeX formats ))
You may also use one of the following templates for Microsoft Word: A4, US letter. Only PDF files will be accepted for the review process, and all submissions must be done through EDAS.

If you have any questions regarding the submission of manuscripts, please contact one of the Technical Program Chairs of the Symposia that you are submitting a paper.