===================================================================
CALL FOR PAPERS
13th IEEE International Symposium on Industrial Embedded Systems,
Topic: ICT for a Dependable Internet of Things

June 6 - 8, 2018, Graz, Austria

Regular Paper Submission Deadline: February 25, 2018
Acceptance notification: April 4, 2018
Camera ready: May 4, 2018

Work-in-progress Paper and Poster Submission Deadline: April 13, 2018
Acceptance notification: April 26, 2018
Camera ready: May 4, 2018

Web: http://sies2018.tugraz.at/
===================================================================

Background: Application domains have a considerable impact on the evolution of embedded systems, in terms of required methodologies and design
paradigms, supporting tools, and resulting technologies. Beside increasingly complex software and growing networks, application-specific hardware
and systems on chips (SoC) will become more and more relevant in all areas of industrial and consumer applications. In order to provide sophisticated
local and global services, there is a growing tendency to co-design hardware, software and networks for smart, dependable and networked devices.
Therein, complex sensor/actuator functionality demands for real-time, safe, and secure signal conversion, data processing, and communication over
large lifetimes of the deployed embedded systems. Apart, there is a clearly visible trend towards an increasing interaction between the affected
domains. In this regard, the Internet of Things (IoT) promises to be one of the most disruptive technologies with transformational impact on industry
and society throughout the next decades. As a global super-infrastructure, the IoT is a key enabling technology for a multitude of application domains,
including smart cities, smart cars, smart home, smart health, smart factories, smart buildings, etc. However, related applications and services are only
feasible if the underlying IoT doesn't fail and disastrous real-world impacts are avoided, making dependability one of its main design challenges.

Aim: The aim of the symposium is to bring together researchers and practitioners from industry and academia. SIES provides a platform to report on
recent developments, deployments, technology trends and research results, as well as to discuss and start initiatives related to embedded systems
and their applications in a variety of industrial environments.

Topics include, but are not limited to:
- Embedded Systems: Dependability Aspects in Embedded Systems (Real-Time, Safety, Security, Maintainability); Design and Validation of
Embedded Systems (Modeling, Languages, Formal Approaches, Certification); Operating Systems and Middleware (Architectures, Timing and
Performance Analysis, Static and Dynamic Scheduling); Power Aware Embedded Computing; Adaptive and Compositional Embedded Systems.
- System-on-Chip and Network-on-Chip: Design & Testing of SoC/NoC; Multiprocessor SoC/NoC (Architectures, Communication, Platforms, Tools,
Programming Paradigms); Design of Application-Specific CPU/MCU Architectures (Single/Multi-Core, DSP); Platform-Based Embedded Systems
Design; Reconfigurable Platforms (Programmable Logic, Partial Reconfiguration); Implementation and Testing of Integrated Circuits.
- Networked Embedded Systems: Design, Dependability and Tooling for Networked Embedded Systems (Real-Time, Safety, Security,
Maintainability); Middleware for Distributed Systems (Self-X, Collaboration, Distributed Localization and Signal Processing, Testing); Network
Protocols for Distributed Systems (Medium Access Control, Self-Organization, Time Synchronization, Routing, Energy-Efficiency).
- Embedded Applications: Cyber-Physical Systems and the Internet of Things (Design, Maintenance, Fault Tolerance, Dependability, Networks,
Infrastructure, Safety, Security, Certification); Domain Specific Embedded Systems (Industrial Automation and Control, Intelligent Transportation
Systems, Automotive, Avionics and Aerospace, Smart Home, Wireless Health Care, Power Station Automation and Control).

===================================================================

Organizing Committee:

General Co-Chairs:
- Marcel Baunach (TU Graz, Austria)
- Roman Obermaisser (University of Siegen, Germany)

Program Committee Co-Chairs:
- Roberto Passerone (Univ of Trento, Italy)
- Stig Petersen (SINTEF, Norway)

WiP and Posters Co-Chairs:
- Tobias Hoßfeld (University of Duisburg, Germany)
- Haibo Zeng (VirginiaTech, USA)

IEEE CEDA Representative
- Yao-Wen Chang (National Taiwan University, Taiwan)

SIES Series Steering Committee:
- R. Ernst (TU Braunschweig, Germany)
- G. De Micheli (EPFL, Switzerland)
- R. Gupta (UC San Diego, USA)
- A. Sangiovanni-Vincentelli (UC Berkeley, USA)
- R. Zurawski (ISA Group, USA)

International Advisory Committee:
- J. J. Chen, Germany
- E. Dekneuvel, UNSA, France
- M. Di Natale, Scuola Superiore S. Anna, Italy
- L. Gomes, Uninova, Portugal
- T. Nolte, Mälardalen University, Sweden
- R. Obermaisser, University of Siegen, Germany
- R. Passerone, Univ. of Trento, Italy SIES
- G. Sassatelli, LIRM, France
- J.-L. Scharbarg, INP-ENSEEIHT & IRIT, France
- E. Tovar, IPP, Portugal
- A. Vachoux, EPFL, Switzerland
- K. Zielinski, AGH UST, Poland
===================================================================