ESTC 2010 seeks original papers describing research in all areas of electronic packaging. Papers may be submitted to the following tracks (see also Conference Topics below):

* Advanced packaging
* Microsystem packaging
* New materials and processes
* Optoelectronics
* Assembly and manufacturing technology
* Modelling and simulation
* Applied reliability
* Power electronics
* Electrical design and modelling
* Emerging technologies

Download Call for Papers here.
Conference Topics

Advanced Packaging
Chair: Klaus Pressel, Infineon, Germany
Co-Chair: Gilles Poupon, CEA-LETI, France

* Advanced packaging involving new materials
* Wafer level packaging including assembly and packaging for ) 45nm CMOS devices
* System-in-Package (SiP), involving MEMS and power packaging
* RF, MEMS and power packaging
* Improved thermal management and new design, environmental protecting packaging
* Fine pitch and high lead count packaging in CSP, BGA, CGA, LGA or SMT packages
* Innovative interconnects applied to advanced packaging



Microsystem Packaging
Chair: Werner Wilke, VDI/VDE, Germany
Co-Chair: Roland Müller-Fiedler, Bosch, Germany

* Application and product-oriented packaging technologies
* New approach of sensor and actuator principles
* Integration of new functionality in microsystems
* Micro-nano integration
* Nanobased advanced packaging technologies (e.g. self assembly, top-down and bottom-up approach, integration of nano-objects, CNT, tools, process)



New Materials and Processes
Chair: Johan Liu, Chalmers University Göteborg, Sweden
Co-Chair: Paul Conway, Loughborough University, UK

* IC packaging processes including bonding and plating processes
* Technology, development and application for adhesives, encapsulants, interconnect materials on substrate and wafer level
* Added functionality materials: magnetic, thermal, optical, nano-enhanced



Optoelectronics
Chair: Giovanni Del Rosso, Pirelli Labs, Italy
Co-Chair: Harri Kopola, VTT, Finland

* Packaging & interconnection strategies for novel roll-to-roll lighting devices
* 100Gb/s Ethernet PIC & ultra-wide band optical transceivers
* Power LED and solid state lighting
* Optical PCB: optical and electrical signal integration
* Hi-power diode laser packaging, couplings, fiber pigtailing and connectorization
* Concentrating photovoltaics (CPV) and optoelectronics in energy



Assembly and Manufacturing Technology
Chair: David Whalley, Loughborough University, UK
Co-Chair: Carlo Cognetti, STMicroelectronics, Italy

* Advanced process development and equipment improvement for volume production
* Cost, yield, performance and environmental impact improvements
* Process characterization
* New product introduction and ramp-up
* Design for flexible manufacturing, testing and burn-in, and design for manufacturing
* Manufacturing simulation, optimisation and scheduling
* MEMS and opto-electronic assembly
* Board level, product and system level assembly



Modeling and Simulation
Chair: Bernd Michel, Fraunhofer IZM, Germany
Co-Chair: E. Mazza, ETH Zürich, Switzerland

* Electrical and mechanical modelling
* Simulation and characterization of packaging solutions including system-level applications
* Prediction of thermal and mechanical performance of packages and modules



Applied Reliability
Chair: Kouchi Zhang, Philips, The Netherlands
Co-Chair: Hans-Jürgen Albrecht, Siemens, Germany

* Reliability field data analysis
* Fast reliability quaification
* Advanced failure analysis
* Failure mode identification and ranking
* Reliability modeling, reliability diagnostics and curing
* Failure prediction and experimental verification
* Characterization and modeling of material
* Process and product behaviour
* Lifetime prediction
* Reliability standards



Power Electronics
Chair: Martin Schneider-Ramelow, Fraunhofer IZM, Germany
Co-Chair: Thomas Harder, ECPE European Center for Power Electronics, Germany

* Further development of high power devices (e.g. IGBT-, MOSFET-packaging)
* Alternative packaging and cooling concepts (e.g. double-sided cooling)
* Prediction of thermal and thermo-mechanical performance of packages and modules
* Reliability investigations and life time prediction
* High temperature applications



Electrical Design & Modeling
Chair: Prof. Elst, Fraunhofer IIS, Germany

* Technology-aware design of circuits and systems - from architectural design to implementation level
* Multi domain system level modelling
* Design for manufacturability and testability
* Design approaches for robust, fail safe and fault tolerant systems
* Impact of integration technology - SiP and 3D
* Advanced methods for 3D floor planning and place & route



Emerging Technologies
Chair: Klaus-Jürgen Wolter, TU Dresden, Germany
Co-Chair: Toni Mattila, TU Helsinki, Finland

* Nano-packaging and bio-electronic packaging
* Organic printable electronics packaging
* Green electronic packaging
* Portable power supply packaging