posted by user: FUN0524 || 3062 views || tracked by 2 users: [display]

ICIEM-Ei 2016 : SCOPUS, Ei--2016 International Conference on Innovative Engineering Materials (ICIEM 2016)

FacebookTwitterLinkedInGoogle

Link: http://www.iciem.org
 
When Aug 20, 2016 - Aug 22, 2016
Where Nanyang Technological University, Singap
Submission Deadline Jun 30, 2016
Categories    robotics   mechanical engineering   manufacturing   physics
 

Call For Papers

2016 International Conference on Innovative Engineering Materials (ICIEM 2016)--SCOPUS, Ei Compendex

August 20-22, 2016 | Nanyang Technological University, Singapore

Official website: http://www.iciem.org

The conference will be held in Nanyang Technological University, Singapore during August 20-22, 2016.The aim of ICIEM 2016 is to present the latest research and results of scientists related to Innovative Engineering Materials topics. This conference provides opportunities for the different areas delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. We hope that the conference results constituted significant contribution to the knowledge in these up to date scientific field.

All submissions will be peer reviewed by 2-3 reviewers.
All the registered and presented papers will be published in volume of Materials Science Forum
(ISSN: 1662-9752,Trans Tech Publications)

Indexed by Elsevier: SCOPUS, Ei Compendex (CPX).

Submission

ISCBI2016 is now accepting manuscript submissions.


Please submit your full paper to us: iciem@saise.org.

Conference Committee

International Advisory Committees

Prof. Tim White, Nanyang Technological University, Singapore
Prof. WANG John, National University of Singapore, Singapore
Prof. Min Wang,The University of Hong Kong, Hong Kong

Conference Committee Chairs

Prof. Dr. Mohd Hamdi Bin Abd Shukor, University of Malaya, Malaysia
Prof. Ir. Dr. Farid Nasir bin Haji Ani, Universiti Technologi Malaysia, Malaysia

Program Committee Chairs

Prof. CHOW Gan Moog, National University of Singapore, Singapore
Prof. Yu-Lun Chueh, National Tsing Hua University, Taiwan
Prof. Masashi Hasegawa, Nagoya University, Japan
Assoc. Prof. Yongsheng GAO, The Hong Kong University of Science and Technology, Hong Kong

Call for Paper

Materials Science and Engineering

Materials Properties, Measuring Methods and Applications

Methodology of Research and Analysis and Modeling

Materials Manufacturing and Processing

Conference Schedule

August 20, 2016: Registration and Collecting conference materials
August 21,2016: Keynote speeches and Oral presentation
August 22,2016: Academic investigation
Contact us
-------------------------------------------------------------- ----
MS. Echo Nie

Tel: +1-302-444-8432 (USA) / +86-18062000004 (China)
Email: iciem@saise.org
Website:http://www.iciem.org

Related Resources

SPIE-Ei/Scopus-CMLDS 2025   2025 2nd International Conference on Computing, Machine Learning and Data Science (CMLDS 2025) -EI Compendex & Scopus
VCOI 2024   International Conference on Vision and Computational Intelligence
SPIE-Ei/Scopus-DMNLP 2025   2025 2nd International Conference on Data Mining and Natural Language Processing (DMNLP 2025)-EI Compendex&Scopus
Ei/Scopus-CEICE 2025   2025 2nd International Conference on Electrical, Information and Communication Engineering (CEICE 2025)
ICoSR 2025   2025 4th International Conference on Service Robotics
SGSE--EI 2025   2025 International Conference on Smart Grid and Sustainable Energy (SGSE 2025)
MEAP 2024   7th International Conference on Mechanical Engineering & Applications
Ei/Scopus-CDIVP 2025   2025 5th International Conference on Digital Image and Video Processing (CDIVP 2025)
MEAP 2024   7th International Conference on Mechanical Engineering & Applications
ICCCI--EI 2025   2025 7th International Conference on Computer Communication and the Internet (ICCCI 2025)