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MIWAI 2017 : The 11th Multi-disciplinary International Workshop on Artificial Intelligence

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Conference Series : Multi-disciplinary Trends in Artificial Intelligence
 
Link: https://khamreang.msu.ac.th/miwai17/index.html
 
When Nov 20, 2017 - Nov 22, 2017
Where Brunei
Submission Deadline Jun 29, 2017
Notification Due Aug 1, 2017
Final Version Due Sep 1, 2017
Categories    artificial intelligence   computer science   information technology   machine learning
 

Call For Papers

The 11th Multi-disciplinary International Workshop on Artificial Intelligence (MIWAI 2017) will be held in Brunei, 20-22 November 2017. The theme for this year's event is on "Smart Environment".

MIWAI aims to promote AI research in both theoretical and applied research addressing real world applications. We encourage researchers to submit their unpublished papers in the following areas, but not limited to:

Theory, Methods & Tools
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Theoretical Foundation:
Cognitive Science; Computational Philosophy; Game Theory; Graphical Models; Knowledge Representation and Reasoning; Logic; Fuzzy Logic; Multi-agent Systems; Neurosciences; Probabilistic Reasoning; Qualitative Reasoning; Uncertainty

Cognitive Computing:
Affective Computing; Computer Vision; Natural Language Processing; Self-aware Systems; Speech Recognition; Social Cognition

Computational Intelligence:
Artificial Intelligence; Deep Learning; Evolutionary Computing; Machine Learning; Pattern Recognition; Planning and Scheduling; Social Computing; Swarm Intelligence

AI Applications
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Ambient Intelligence; Big Data Analysis; Biometrics; Bioinformatics; Brain Machine Interface; Chatbots; Creative Computing; Decision Support Systems; E-commerce; Energy Management; Health Assessment; Industrial Applications of AI; Intelligent Information Systems; Knowledge Management; Telecommunications and Web Services; Security and Privacy Management; Surveillance; Spam Filtering; Software Engineering; Social Networking Security; Semantic Web; Robotics; Recommender Systems; Sport and Rehabilitation; Virtual Reality & Augmented Reality


Submission Guideline
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MIWAI 2017 accepts two categories of research and application papers:
- Regular papers (8-14 pages, oral presentation)
- Short papers (6 pages, poster or oral presentation)

All submissions will go through a double-blinded peer-review process. Paper selection will be on the basis of technical quality, relevance, significance, and clarity. Each paper should be written using the Springer-Verlag LNCS style. The authors' names and institutions should not appear in the paper. Springer-Verlag author instructions are available at: http://www.springer.com/lncs

All accepted and presented papers will be included in the proceedings of MIWAI 2017 which will be published by Springer in LNAI, a topical subseries of LNCS focusing on artificial intelligence (Indexed in the ISI Conference Proceedings Citation Index, Scopus, EI Engineering Index, Google Scholar, DBLP, etc.)


POST-CONFERENCE JOURNALS
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Fast Track
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Authors of best papers will be invited to submit extended versions (at least 30% of new content) of their work to be appreciated for publication in a Fast Track submission process of the Elsevier Applied Soft Computing (ASOC) Journal.

Special Issues
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The organisers are in talks with the following international journals to arrange for publication of special issues.

- International Journal of Gaming and Computer-Mediated Simulations (IJGCMS) - IGI
- Natural Computing - Springer

Selected authors will be invited to contribute to these special issues.

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IEEE CSEE 2026   IEEE--2026 The 7th International Conference on Computer Science, Engineering, and Education (CSEE 2026)
IEEE-ICECCS 2026   2025 IEEE International Conference on Electronics, Communications and Computer Science (ICECCS 2026)
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WSCE 2026   IEEE--2026 The 9th World Symposium on Communication Engineering (WSCE 2026)
AAIML 2027   IEEE--2027 2nd International Conference on Advances in Artificial Intelligence and Machine Learning
AIAM 2026   2026 3rd China-Europe Scientists Forum & 8th International Conference on Artificial Intelligence and Advanced Manufacturing
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