posted by user: tranxuantu || 3646 views || tracked by 2 users: [display]

ICICDT 2022 : 2022 International Conference on IC Design and Technology (ICICDT)

FacebookTwitterLinkedInGoogle

Link: http://icicdt2022.org/
 
When Sep 21, 2022 - Sep 23, 2022
Where Hanoi, Vietnam
Abstract Registration Due Jun 1, 2022
Submission Deadline Jun 10, 2022
Notification Due Jul 30, 2022
Final Version Due Aug 10, 2022
Categories    ic design   system-on-chip   VLSI   EDA
 

Call For Papers

Dear Colleagues,

Please accept our apologies if you receive multiple copies of this CfP.

====================================================
* International Conference on IC Design & Technology
* Hanoi, Vietnam, September 21-23, 2022
* http://icicdt2022.org/
====================================================

Design and technology co-optimization provide key advantages in the highly competitive market today. However, integrated circuit (IC) engineering traditionally separates design and technology and the two don’t use the same language, let alone understand each other. This is not a winning approach moving forward. Savvy IC engineers require a deeper understanding of the inter-dependencies between design and technology options to expand the product optimization window. ICICDT is, by design, a forum for engineers, researchers, graduate students and professors, to cross the design-technology boundary by bringing design, technology, and process experts together. Its unique format of each paper has a short presentation and a poster is designed to encourage asking questions and sharing knowledge on a one-to-one basis during the poster session.
Venue: 2022 International Conference on IC Design and Technology (ICICDT) will be held in Hanoi – the historical capital and charming city of Vietnam. The location is also very near Ha Long Bay – a World Natural Heritage site.

Contributed papers are solicited in the following subject areas (but not limited to):
* Advanced materials and processing technologies, power semiconductor technologies and circuits;
* Advanced transistor and interconnect structures;
* Advanced packaging, heterogeneous integration, lateral and vertical (2.5D/3D) integration;
* Variation and fault-tolerant designs, reliability issues and mitigation approaches, EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability;
* RF, analog, mixed signal, and I/O circuits for future technology generations;
* Simulation and modeling of advanced processes, devices, and circuits;
* Design for manufacturing, yield, and test, System-on-Chip (SoC) and System-in-Package (SiP) design integration;
* Emerging technologies, circuits and applications (MEMS, Memory, Internet of Things, Autonomous cars, Machine Learning, Artificial Intelligence).


Paper Submission Deadline: June 1st, 2022

Conference Sponsors
- The ICICDT 2022 conference is co-sponsored by VNU Information Technology Institute – Vietnam National University, Hanoi and Le Quy Don Technical University. The conference is also technically supported by the IEEE Solid-State Circuits Vietnam Chapter, the IEEE Circuits and Systems Vietnam Chapter, the IEEE Vietnam Section, and the IEICE Vietnam Section.

2022 ICICDT Executive Committee Members

Advisory Committee:
Bao Son Pham (Vietnam National University, Hanoi)
Xuan Nam Tran (Le Quy Don Technical University)
Stefano D’Amico (University of Salento)
Wenke Weinreich (Fraunhofer IPMS)
Yuichiro Mitani (Tokyo City University)

General Chair: Xuan Tu Tran (VNU Information Technology Institute)

Executive Chair: Bich-Yen Nguyen (Soitec)
Thuy Dao (NXP)

Technical Conference Chair: Van Phuc Hoang (Le Quy Don Technical University)
Gong Xiao (National University of Singapore)

Local Arrangement Chair: Duy-Hieu Bui (VNU Information Technology Institute)

Keynote Chair: Brian Chen (GlobalFroundries)
Philippe Galy (STMicroelectronics)

Tutorial Chair: Nguyen Ngoc Mai Khanh (University of Tokyo)
Quang Kien Trinh (Le Quy Don Technical University)

Exhibition Chair: Toan Dao (University of Transportation and Communication)
Pham Nguyen Thanh Loan (Hanoi University of Science and Technology)

Publicity & Award Chair: Dr. Kin P. Cheung (NIST)
Koichiro Ishibashi (University Electro-Communications, Japan)

Publication Chair: Van Trung Nguyen (Le Quy Don Technical University)
Quoc-Bao Nguyen Vo (Post and Telecommunication Institute of Technology)

Treasurer: Duy-Hieu Bui (VNU Information Technology Institute)
Dina Triyoso (TEL)

Secretary: Duy-Anh Nguyen (Vietnam National University, Hanoi)




Related Resources

IC-MBE 2025   IC-MBE 2025 HYBRID CONFERENCE, 14th International Conference on Management, Business and Economics
IC-AIF 2026   2026 International Conference on Artificial Intelligence and Fintech-EI/Scopus
Information Technology for Smart Healthc 2025   Information Technology for Smart Healthcare
IC 2026   The 9th International Conference on Innovative Computing
3rd-IC 2025   The Withering Panopticon? Evidence from Everyday Life in North Korean Cities
EI/Scopus-MRT 2025   2025 2025 International Conference on Mechatronics and Rail Transportation-EI/Scopus
Between History and Design 2025   Between History and Design: Asian American and Diasporic Architecture in the Twentieth Century
BPM Process Technology Forum 2025   Process Technology Forum at BPM 2025: Call for papers
Digital Technology and Language Teaching 2025   Routledge-CRC Press-Taylor and Francis Call for Chapters: Digital Technology and Language Teaching: Exploring New Frontiers in Language Education
MuSE IC 2025   MuSE International Conference 2025: Multidisciplinary Sciences for Sustainability