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TechDebt 2018 : First International Conference on Technical Debt | |||||||||
Link: https://2018.techdebtconf.org/track/TechDebt-2018-papers | |||||||||
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Call For Papers | |||||||||
First International Conference on Technical Debt
Gothenburg, Sweden, May 27-28 2018 (collocated with ICSE 2018) https://2018.techdebtconf.org/ SUBMISSION DEADLINES * January 15th: Abstract submitted to EasyChair * January 22nd: Full papers entered in EasyChair * March 1st: Notification of acceptance / rejection * March 15th: Camera ready submission of final paper * May 27-28th: Presentations GOALS Technical debt is a metaphor that software developers and managers increasingly use to communicate key tradeoffs related to release and quality issues. The Managing Technical Debt workshop series had, since 2010, brought together practitioners and researchers to discuss and define issues related to technical debt and how they can be studied. Workshop participants reiterated the usefulness of the concept each year, shared emerging practices used in software development organizations, and emphasized the need for more research and better means for sharing emerging practices and results. As the interest from our industry and academic researchers in Technical Debt has steadily grown, the workshop series has morphed into a full conference in 2018. Our goal for this conference on Technical Debt is to bring together leading software engineering researchers and practitioners for the purpose of exploring theoretical and practical techniques for managing technical debt. SCOPE The following topics are aligned with the conference theme: * Identification of technical debt * Visualization of technical debt * Analysis of technical debt * Metrics for technical debt * Economic models for describing or reasoning about technical debt * Understanding causes and effects of technical debt * Relationship of technical debt to software evolution, maintenance, and aging * Relationship of technical debt with other activities, such as testing or requirement elicitation * The business case for technical debt management * Technical debt and software life-cycle management * Technical debt within a software ecosystem * Technical debt in designs and architecture * Technical debt in software models * Techniques and tools for calculating technical debt principal and interest * Concrete practices and tools used to measure and control technical debt * Education related to technical debt PAPER SUBMISSION We invite submissions of papers in any areas related to the theme and goal of the conference in the following three categories: * Research Papers: describing innovative and significant original research in the field (up to 10 pages max.) * Industrial Papers: describing industrial experience, case studies, challenges, problems, and solutions (up to 10 pages max) * Short papers: Position and Future Trend Papers: describing ongoing research, new results (up to 5 pages max.) Submissions must be original and unpublished work. Each submitted paper will undergo a rigorous review process by three members of the program committee. Submissions must be submitted online via the TechDebtConf2018 EasyChair conference management system https://easychair.org/conferences/?conf=techdebt2018 and conform to the ICSE formatting guidelines. The official publication date is the date the proceedings are made available in the ACM Digital Library. This date may be up to two weeks prior to the first day of ICSE 2018. The official publication date affects the deadline for any patent filings related to published work. Purchases of additional pages in the proceedings is not allowed. Accepted papers must be presented in person at the conference by one of the authors. Excellent papers will be considered for a Distinguished Paper Award from ACM Sigsoft. PROGRAM COMMITTEE Philippe Kruchten, University of British Columbia (Co-chair) Frank Buschmann, Siemens, Co-chair (Co-chair) Esra Alzaghoul, University of Jordan FrancescaArcelli Fontana, University of Milano Bicocca Paris Avgeriou, University of Groningen Stephany Bellomo, Software Engineering Institute Ayse Bener, Ryerson University Terese Besker, Chalmers University Christian Bird, Microsoft Research Jan Bosch, Chalmers University of Technology Frank Buschmann, Siemens Alexander Chatzigeorgiou, University of Macedonia Zadia Codabux, Colby College Robert Eisenberg, Lockheed Martin Hakan Erdogmus, Carnegie Mellon University Davide Falessi, CalPoly Steven Fraser, Innoxec Juan Garbajosa, Universidad Politecnica de Madrid (UPM) Olivier Gaudin, SonarSource Johannes Holvitie, University of Turku Clemente Izurieta, Montana State University Andreas Jedlitschka, Fraunhofer IESE Sven Johann, innoQ Heiko Koziolek, ABB Corporate Research Ville Leppänen, University of Turku Jean-Louis Letouzey, Inspearit Alan Maccormack, Harvard Antonio Martini, Chalmers University of Technology Andrew Meneely, Rochester Institute of Technology David Morgenthaler, Google Ipek Ozkaya, Carnegie Mellon Software Engineering Institute Jennifer Perez, Technical University of Madrid Eltjo Poort, CGI Terri Potts, Raytheon Narayan Ramasubbu, University of Pittsburgh Gonzalo Rojas, University of Concepcion Klaus Schmid, University of Hildesheim Carolyn Seaman, UMBC Andriy Shapochka, SoftServe Emad Shihab, Concordia University Forrest Shull, Software Engineering Institute Will Snipes, ABB Corporate Research Wolfgang Trumler, Siemens AG Eberhard Wolff, Adesso Jesse Yli-Huumo, Aalto University Olaf Zimmermann, HSR FHO |
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