posted by user: daneshtalab || 5541 views || tracked by 8 users: [display]

TECS 2013 : Special Issue on Design Challenges for Many-core Processors - ACM Transactions on Embedded Computing Systems (TECS)

FacebookTwitterLinkedInGoogle

Link: http://acmtecs.acm.org/si/12/dcmp12.htm
 
When N/A
Where N/A
Submission Deadline Dec 1, 2012
Notification Due Mar 15, 2013
Final Version Due Sep 15, 2013
Categories    manycore   multicore   operating system   network on chip
 

Call For Papers

General Scope
Many-core processors are moving towards the integration of hundreds cores on a single chip and hold the promise of increasing performance through parallelism. As the number of cores integrated into a chip increases, the on-chip communication becomes power and performance bottleneck in future many-core processors. Network-on-Chip (NoC) architecture has been proposed as the most viable solution to meet the performance and design productivity requirements of the complex on-chip communication infrastructure. NoC provides an infrastructure for better modularity, scalability, fault-tolerance, and higher bandwidth compared to traditional infrastructures. On the other hand, developing applications using the full power of NoC-based many-core processors requires software developers to transition from writing serial programs to writing parallel programs. On top of that, for managing many-core resources, contemporary Operating Systems (OS) have been designed to run on a small number of reliable cores and are not able to scale up to hundreds of cores. Therefore, designing scalable and faultless OSs will be a tremendous challenge in future many-core processors.
The goal of this special issue is to present and discuss innovative ideas and solutions in the design, modeling, prototyping, programming, and implementation of many-core processors.
Topics of interest include but are not limited to:
• NoCs (routing, arbitration, switch architecture, etc.)
• Mapping of applications (static, dynamic, etc.)
• OS (centralized, distributed, scheduling, allocation, memory management, etc.)
• Reliability issues
• Physical design
• 3D stacked technology
• Synthesis, verification, debug & test
• Performance and power issues
• Reconfigurability aspects
• FPGA implementation
• Programming model and scalable software
• Compiler technologies
• Many-core as accelerators
• Many-core embedded systems
• Heterogeneity challenges
Submitted articles must not have been previously published or currently submitted for publication elsewhere. For work that has been published previously in a workshop or conference, it is required that submissions to the special issue have at least 40% new content. Submissions that do not meet this requirement will be rejected without review.

Guest Editors,
Masoud Daneshtalab, University of Turku, Finland (masoud.daneshtalab@utu.fi)
Maurizio Palesi, University of Enna, “Kore”, Italy (maurizio.palesi@unikore.it)
Juha Plosila, University of Turku, Finland (juha.plosila@utu.fi)

Related Resources

Ei/Scopus-ITCC 2026   2026 6th International Conference on Information Technology and Cloud Computing (ITCC 2026)
IEEE-ICECCS 2026   2025 IEEE International Conference on Electronics, Communications and Computer Science (ICECCS 2026)
Ei/Scopus-CEICE 2026   2026 3rd International Conference on Electrical, Information and Communication Engineering (CEICE 2026)
Transition Design Conference 2026   Transition Design Conference 2026: Weaving Regenerative Futures
IEEE-Ei/Scopus-ICISC 2026   2025 6th International Conference on Intelligent System and Computing (ICISC 2026)
Ei/Scopus-CMLDS 2026   2026 3rd International Conference on Computing, Machine Learning and Data Science (CMLDS 2026)
CVIPPR 2026   2026 4th Asia Conference on Computer Vision, Image Processing and Pattern Recognition (CVIPPR 2026)
ACM ICDLT 2026   ACM--2026 The 10th International Conference on Deep Learning Technologies (ICDLT 2026)
ACM ICCBDC 2026   ACM--2026 the 10th International Conference on Cloud and Big Data Computing (ICCBDC 2026)
ACM ICCAI 2026   ACM--2026 12th International Conference on Computing and Artificial Intelligence (ICCAI 2026)