Latest serial applications in the MID technology and the increasing range of innovative manufacturing solutions for molded interconnect devices strongly emphasize the growing market success of this technology. Innovative assembly and equipment producers of MID technology record significant growth rates. The direct application of the electronic on various three-dimensional substrates offers versatile design and rationalization potentials for mechatronic systems.

Up-to-date information and expert discussions can set major impulses for the successful implementation of this innovative and interdisciplinary technology as well as for a stable assessment of the growth areas. The conferences about MID technology in the metropolitan region Nuremberg have established themselves as international most significant forum about this technology.

Experts of industry and research are invited, to present a paper on the topics listed below:
Innovation with MID, MID - Implementation and Realization, Integrated CAD / CAM Systems, Materials for MID, Plastics Processing, Metallization, Structuring of Circuit Paths, 3D Assembly, Quality Assurance, Future Trends

Important dates:
29.02.2016 Submission of abstracts
29.04.2016 Information about program selection
30.06.2016 Submission of full papers
15.07.2016 Review of full papers
31.07.2016 Submission of final papers
31.07.2016 Submission of presentation slides
28.-29.09.2016 International Congress MID 2016
30.09.2016 Technical Tours

Your contact person

'Sylvia Gerlach' for: organization, participants, location
e-mail: gerlach@3dmid.de; phone: +49 911 5302-9100

'Thomas Kuhn' for: program design, speakers, articles
e-mail: kuhn@3dmid.de; phone: +49 911 5302-9101

Research Association 3-D MID e.V.
Fuerther Str. 246b
D-90429 Nuremberg