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CALL FOR PAPERS

IEEE ICESS-2015
12th IEEE International Conference on Embedded Software and Systems

http://cse.stfx.ca/~icess2015/index.html
August 24-26, 2015, New York, USA

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IMPORTANT DATES
Abstract submission: April 3, 2015
Paper submission: April 30, 2015
Acceptance notification: June 15, 2015
Camera-ready papers: July 15, 2015
Conference Date: August 24-26, 2015

SCOPE
The ICESS-2015 conference is the 12th IEEE International Conference on Embedded Software and Systems. It provides an international forum for presenting and discussing emerging ideas and trends in embedded software and systems from both the research community as well as the industry. ICESS-2015 is sponsored by IEEE, IEEE Computer Society, and IEEE Technical Committee on Scalable Computing (TCSC).
TOPIC OF INTEREST

Track I: Systems, Models and Algorithms
Embedded System Architecture
Embedded Software Architectures
Embedded OS, Scheduling and Runtime Support
Embedded Storage and I/O Systems
Real-Time Embedded Systems
Distributed and Networked Embedded Systems
Fault Tolerant and Trusted Embedded Systems
Mixed-Critical Embedded Systems
Heterogeneous SoC and Multicore Embedded Systems
Power and Thermal Aware Computing
Pervasive/Ubiquitous Computing
Reconfigurable Embedded Computing

Track II: Design Methodology and Tools
Design Technologies of Embedded Systems
Formal Methods for Embedded Systems
Middleware for Embedded Systems
IDE and Software Tools
Hardware/Software Co-Design
Component-Based Embedded Software Design
Model-based Design for Embedded Software
Domain/Application-Specific Design Techniques
Testing Techniques for Embedded Software/Systems
Verification and Validation for Embedded Systems
Compilation and Debug Techniques and Tools
Performance Evaluation Techniques and Tools

Track III: Emerging Embedded Applications and Interdisciplinary Topics
Intelligent Embedded Systems
Robotics and Control Systems
Wireless Sensor Networks (WSN)
Cyber-Physical Systems
Embedded Automotive, Medical and Avionics Systems
Embedded Database & Multimedia Systems
QoS Support for Embedded Systems
Embedded Network Protocol and Security
Emergency and Disaster Management
Consumer Electronics
Mobile Cloud Computing
Industrial Practices and Case Studies

PAPER SUBMISSION AND PUBLICATION

Successful submissions should contain significant novel ideas and technical results, which have not been published or concurrently submitted to any other venue.
Submitted manuscripts should be written in English conforming to the IEEE conference proceedings format (8.5" x 11", Two-Column, template available at http://www.computer.org/portal/web/cscps/formatting). Manuscripts should not exceed 8 pages, including tables, figures and references. All paper submissions must represent original and unpublished work. Papers must be submitted electronically in PDF format through EasyChair.
The accepted papers from this conference will be published by IEEE Computer Society in IEEE proceedings (indexed by EI Compendex). Distinguished papers, after further revisions, will be considered for possible publication in several SCI & EI indexed special issues of prestigious international journals. By submitting a paper to the conference, authors assure that if the paper is accepted, at least one author will attend the conference and present the paper.

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ORGANIZING COMMITTEE

Publicity Co-Chairs
Weichen Liu, Chongqing University, China
Geoffrey Nelissen, Instituto Superior de Engenharia do Porto, Portugal
Ying Lu, University of Nebraska - Lincoln, USA

Publication Chair
Tam Chantem, Utah State University, USA

Workshop Chair
Chun Jason Xue, City University of Hong Kong, Hong Kong

Steering Committee Co-Chairs
Zhaohui Wu, Zhejiang University, China
Laurence T. Yang, St. Francis Xavier University, Canada

General Chairs
Meikang Qiu, Pace University, USA

General Co-Chairs
Sun-Yuan Kung, Princeton University, USA
Jack Dongarra, University of Tennessee, Knoxville, USA

Program Chairs
Dakai Zhu, University of Texas at San Antonio, USA
Samarjit Chakraborty, Technical University Of Munich, Germany

Track Chairs
Systems, Models and Algorithms
Dakai Zhu, University of Texas at San Antonio, USA

Design Methodology and Tools
Dionisio de Niz, Carnegie Mellon University, USA
Qi Zhu, University of California, Riverside, USA

Emerging Embedded Applications and Interdisciplinary
Song Han, University of Connecticut, USA
Christian Poellabauer, University of Notre Dame, USA

Technical Program Committee
Track 1: Systems, Models and Algorithms (SMA)
Bjorn A. Andersson, Carnegie Mellon University, USA
Albert M. K. Cheng, University of Houston, USA
Alireza Ejlali, Sharif University of Technology, Iran
Nathan Fisher, Wayne State University, USA
Marisol García-Valls, Universidad Carlos III de Madrid, Spain
Luis Gomes, UUniversidade Nova Lisboa / UNINOVA, Portugal
Nan Guan, Northeastern University, China
Yifeng Guo, Netapps Inc. USA
Shih-Hao Hung, National Taiwan University, Taiwan
Kyoung-Don Kang, SUNY Binghamton, USA
Chin-Fu Kuo, National University of Kaohsiung, Taiwan
Haohan Li, The MathWorks, USA
Cong Liu, University of Texas at Dallas, USA
Weichen Liu, Chongqing University, China
Ying Lu, University of Nebraska - Lincoln, USA
Mingsong Lv, ortheastern University, China
Geoffrey Nelissen, Instituto Superior de Engenharia do Porto, Portugal
Gang Quan, Florida International University, USA
Harini Ramaprasad, University of North Carolina at Charlotte, USA
Shangping Ren, Illinois Institute of Technology, USA
Zili Shao, The Hong Kong Polytechnic University, Hong Kong
Hiroyuki Tomiyama, Ritsumeikan University, Japan
Qi Xuan, Oracle Inc. USA

Track 2: Design Methodology and Tools (DMT)
Manuel E. Acacio, University of Murcia, Spain
Jian-Jia Chen, Technical University of Dortmund, Germany
Qingxu Deng, Northeastern University, China
Marco Di Natale, Scuola Superiore Sant'Anna, Italy
Petru Eles, Linköping University, Sweden
Aniruddha Gokhale, Vanderbilt University, USA
Sathish Gopalakrishnan, University of British Columbia, Canada
Zonghua Gu, Zhejiang University, China
Michael Gonzalez Harbour, Universidad de Catambria, Spain
Houcine Hassan, Universitat Politecnica de Valencia, Spain
Pablo Ibez-Marn, Universidad de Zaragoza, Spain
Seon Kim, Korea University, Korea
Jihong Kim, Seoul National University, Korea
Wenchao Li, SRI International, USA
Chung-Wei Lin, University of California, Berkeley, USA
Alberto Macii, Politecnico di Torino, Italy
Sibin Mohan, University of Illinois UC, USA
Vincent Nelis, Polytechnic Institute of Porto, Portugal
Lee Pike, Galois Inc., USA
Zhengwei Qi, Shanghai Jiao Tong University, China
Jean-Pierre Talpin, INRIA, France
Chun Jason Xue, City University of Hong Kong, Hong Kong
Youtao Zhang, University of Pittsburgh, USA
Wei Zhang, Virginia Commonwealth University, USA

Track 3: Emerging Embedded Applications and Interdisciplinary (EAI)
Alessio Bechini, University of Pisa, Italy
David Broman, KTH Royal Institute of Technology/UC Berkeley, Sweden/USA
Qing Cao, University of Tennessee, USA
Yuan-Hao Chang, Academia Sinica, Taiwan
Deji Chen, Tongji University, P. R. China
David Eyers, University of Otago, New Zealand
Mikael Gidlund, Mid Sweden University, Sweden
Jen-Wei Hsieh, National Taiwan University of Science and Technology, Taiwan
Robert Hsu, Chung Hua University, Taiwan
Jingtong Hu, Oklahoma State University, USA
Zhiyi Huang, University of Otago, New Zealand
Qun Li, College of William and Mary, USA
Jogesh Muppala, The Hong Kong University of Science and Technology, Hong Kong
Rodolfo Pellizzoni, University of Waterloo, Canada
Qixin Wang, The Hong Kong Polytechnic University, Hong Kong
Thomas Watteyne, UC Berkeley/DUST Networks, USA
Wenyao Xu, SUNY Buffalo, USA
Fumin Zhang, Georgia Institute of Technology, USA
Liqiang Zhang, Indiana University South Bend, USA