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EMPC 2017 : European Microelectronics and Packaging Conference & Exhibition | |||||||||||||
Link: http://www.empc2017.pl | |||||||||||||
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Call For Papers | |||||||||||||
The 2017 European Microelectronics and Packaging Conference (EMPC) will be held for the first time in Poland, at
Warsaw University of Technology on September 10 - 13, 2017. The conference will include a plenary session, parallel symposia and will be accompanied by thematic exhibition. ABSTRACTS ARE BEING REQUESTED IN THE FOLLOWING AREAS: - Advanced packaging and interconnects - Electronics components assembly and PCB solutions - Materials and processes - Printed, hybrid and flexible electronics - Modeling, design test & reliability - Functional systems (actuators, sensors, photovoltaics and related) All submitted abstracts must represent original, previously unpublished work. We look forward to welcome you to an inspiring and stimulating event. |
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