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EMPC 2015 : 20th European Microelectronics Packaging Conference | |||||||||
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Call For Papers | |||||||||
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Authors are invited to submit an abstract of 250 words (no figures, no tables, no formulas) that provides original and previously unpublished, non-confidential and non-commercial information. Please enter your abstract into the online conference system using the following link: https://www.conftool.com/empc2015/
Papers can cover a wide range of topics from the realms of: Si and Glass Interposers & 2.5 / 3D Packaging The Future of Packaging Advanced Packaging, Interconnects & Assembly / Application Fields Materials & Processes Modeling, Design, Test & Reliability A prize for both the best paper and the best poster presentation will be awarded by the program committee. In case of questions please contact our conference office at empc@mcc-pr.de |
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