BioCAS 2018 is a premier international forum for presenting the interdisciplinary research
and development activities at the crossroads of medicine, life sciences, physical sciences
and engineering that shape tomorrow’s medical devices and healthcare systems.

This conference brings together members of our communities to broaden their knowledge
in emerging areas of research at the interface of the life sciences and the circuits and
systems engineering. The three-day single-track program for BioCAS 2018 is multidisciplinary
in topics including but not limited to:
Biomedical Technologies
• Assistive, Rehabilitation, and Quality of
Life Technologies
• Biofeedback, Neuromodulation, and
Closed-Loop Systems
• Bio-Inspired and Neuromorphic Circuits
and Systems
• Biosensor Devices and Interface Circuits
• Biotelemetry and Energy Harvesting/
Scavenging Circuits and Systems
• Body Area/Sensor Network and
Wireless/Wearable Health Monitoring
• Electronics for Neuroscience
• Implantable Medical Electronics
• Lab-on-Chip and BioMEMS
• Point-of-Care Technologies for
Healthcare
Biomedical Applications
• Biomedical Imaging and Image
Processing
• Biosignal Recording, Processing, and
Machine Learning
• Genomics and Systems Biology
• Human-Machine Interfaces
• Medical Information Systems and
Bioinformatics
Please visit:
www.biocas2018.org
IMPORTANT DATES
Monday, April 23, 2018
Special Session Proposal Deadline
Monday, June 11, 2018
Regular Paper Submission Deadline
Monday, July 16, 2018
Live Demo Submission Deadline
Monday, August 13, 2018
Author Notification Date
Friday, August 31, 2018
Author Registration/Final Paper
Submission Deadline
Submission Guidelines
The complete 4-page paper (in standard IEEE double-column format), including the
title, authors’ names, affiliations and e-mail addresses, as well as a short abstract and an
optional demonstration video link (3 minute max) are requested. Papers must be submitted
electronically in PDF format through www.biocas2018.org.
Keynote Speakers
IEEE CIRCUITS AND SYSTEMS SOCIETY
CALL FOR PAPERS
Michael Roukes, Ph.D.
Robert M. Abbey Professor of
Physics, Applied Physics, and
Biological Engineering
California Institute of
Technology, USA
Andrew DeHennis, Ph.D.
Director, Engineering, R&D
Senseonics, Inc., USA
Utkan Demirci, Ph.D.
Professor of Radiology and
Electrical Engineering
Stanford University School of Medicine, USA