The International Symposium on Embedded Multicore/Many-core System-on-Chip (MCSoC-14) aims at providing the
world's premier forum of leading researchers in the embedded Multicore/Many-core SoCs software, tools and
applications design areas for Academia and industries. Prospective authors are invited to submit paper of their works.
Submission of a paper implies that at least one of the authors will have a full registration to the symposium upon
acceptance of the paper.

Important dates:

Paper Submission:March 31, 2014 ---) April 30, 2014 (EXTENDED).
Notification of Acceptance:May 31, 2014
Camera Ready Paper:June 30, 2014
Symposium Date:September 24-26, 2014

Topics of Interests:

Embedded Multicore/Many-core Programming: Compilers, cross assemblers, Programming models including shared memory, message passing and novel programming models, memory management, object-oriented aspects, concurrent software for SoCs.
Embedded Multicore/Many-core Architectures: Multicore, Many-core, reconfigurable platforms, memory management support, communication, protocols, real-time systems, SoCs, DSPs
Embedded Multicore/Many-core Design : Hardware specification, modeling, synthesis, low power simulation and analysis, reliable, performance modeling, security issues.
Embedded Multicore/Many-core Interconnection Networks: Electronic/Photonic/RF NoC C architecture, Power and energy issues in NoC , Application specific NoC design, Timing, synchronous /asynchronous communication, RTOS support for NoC, Modeling, simulation, NoC support for MCSoC, NoCs for FPGAs and structured ASICs, NoC design tools, Photonic components, Virtual fabrications, Photonic circuits, Routing, Filter design.
Embedded Multicore/Many-core Testing: Design-for-test, test synthesis, built-in self-test, embedded test for MCSoC Multicore Practices & Benchmarks: Software, tools, trends, emerging technologies, experience maintaining benchmark suites, representation, tools, copyrights, maintenance.
Embedded Multicore/Many-core Packaging Technologies: 3D VLSI packaging Technology, Vertical Interconnections in 3D Electronics, Periphery Interconnection between Stacked ICs, Area Interconnection between Stacked ICs, Thermal Management.
Embedded Multicore/Many-core Real-Time Systems: real-time system design, OS, Compilation techniques, memory/cache optimization, interfacing and software issues, Software, distributed real-time systems, real-time kernels, task scheduling, multitasking design.
Embedded Multicore/Many-core Benchmarks: Parallel Benchmarks, Workload characterization and evaluation
Embedded Multicore/Many-core Applications: bio-medical, aviation, automobile, military, consumer electronics, and novel applications.

Submission
The paper should be prepared according to the IEEE CS format, and no longer than 8 pages. Each submitted paper
will be reviewed by at least three reviewers and will be evaluated based on originality, significance to Symposium's
topics, organization, and technical quality.

Submission of a paper implies that at least one of the authors will have a full registration to the symposium upon
acceptance of the paper. All submitted papers to the MCSoC-14 should be submitted online.

Click here to submit online

Proceedings Publication and Indexing:
MCSoC-14 proceedings will be published by IEEE CS Press, which will be included in the Computer Society Digital
Library CSDL
and IEEE Xplore. All CPS conference publications are also submitted for indexing to EI’s Engineering Information
Index, Compendex,
and ISI Thomson’s Scientific and Technical Proceedings, ISTP/ISI Proceedings, and ISI Thomson

Best Paper Award:
IEEE MCSoC-14 features Best Paper Award to award authors with superior quality paper submission to this
Symposium. The award includes a certificate. The authors of Best Paper Award will be recognized in the conference.
Eligibility: Any paper published in the IEEE MCSoC-14 symposium.
Nomination: The nominations are made by the symposium's best-paper-award selection chairs.