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CALL FOR PAPERS
13th Electronic Circuits World Convention (ECWC13)
May 7 - 9 2014, Nuremberg, Germany
Organizer: EIPC - European Institute of Printed Circuits
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THE CONFERENCE
The 13th Electronic Circuits World Convention (ECWC13) will take place from 7 - 9 May 2014 in conjunction with the SMT Hybrid Packaging exhibition. The conference is organized every three years alternately by the members of the WECC association. In 2014, for the first time in eleven years the conference will be hosted in Europe.

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THE TOPICS

Management
M1 Global Market Trends and Outlook
M2 Supply Chain Management
M3 Environment, Health and Safety
M4 Business Models and Strategy
M5 Certification and Qualifications
M6 Total Cost of Ownership and Overall Equipment Efficiency


Technology
T1 Design and Development Tools
T2 Materials, Components and Traceability
T3 Manufacturing
T3.1 Equipment
T3.2 Technology
T3.3 Process Development
T3.4 Automation
T4 Quality, Test and Life Cycle Management
T5 PCB Processes
T5.1 Chemical Technology
T5.2 Mechanical Technology
T5.3 Optical Technology
T6 Surface Mounting, Assembly and Interconnection
T7 Packaging Technology
T7.1 System in Package
T7.2 Wafer-Level Packaging
T7.3 Panel-Level Packaging
T8 Energy and Resource Efficiency
T9 Application Specific Areas
T9.1 Automotive Electronics and Electromobility
T9.2 Industrial and Power Electronics
T9.3 Aerospace and Defence
T9.4 Medical Electronics
T9.5 Consumer Electronics
T10 Advanced and Emerging Technologies

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SUBMISSION
Abstracts need to use the provided submission template.
PDFs of the abstract to be uploaded online at http://www.mesago.de/en/ECWC/The_Conference/Submission/index.htm
or www.ecwc13.org

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CONFERENCE LANGUAGE
English

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PRESENTATION TYPES
Oral presenation, poster presentation

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