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NOCS 2014 : International Symposium on Networks-on-ChipConference Series : Networks-on-Chips | |||||||||||||||
Link: http://mpsoc.unife.it/~nocsymposium/callforpapers.html | |||||||||||||||
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Call For Papers | |||||||||||||||
The International Symposium on Networks-on-Chip (NOCS) is the premier event dedicated to interdisciplinary research on on-chip, chip-scale, and multichip package-scale communication technology, architecture, design methods, applications and systems. NOCS brings together scientists and engineers working on NoC innovations and applications from inter-related research communities, including computer architecture, networking, circuits and systems, packaging, embedded systems, co-design, and design automation. Topics of interest include, but are not limited to:
NoC Architecture and Design Network architecture (topology, routing, arbitration) NoC Quality of Service Timing, synchronous/asynchronous communication Network interface issues NoC design methodologies and tools Mapping of applications onto NoCs Signaling & circuit design for NoC links NoC Application NoC case studies application-specific NoC designs NoC designs for heterogeneous many-core systems, fused CPU-GPU architectures, FPGA-based systems etc NoC Analysis, Verification and Modeling NoC Analysis, Verification and Modeling Modeling, simulation, and synthesis of NoCs Verification, debug & test of NoCs Metrics and benchmarks for NoCs Scalable modeling of NoCs NoC at the Un-Core and System-level Design of memory subsystem (un-core) including memory controllers, caches, cache coherence protocols & NoCs NoC support for memory and cache access OS support for NoCs Programming models including shared memory, message passing and novel models Issues related to large-scale systems (datacenters, supercomputers) with NoC-based systems as building blocks Novel NoC Technologies New physical interconnect technologies, e.g., carbon nanotubes, wireless NoCs, through-silicon, etc. NoCs for 3D and 2.5D packages Package-specific NoC design Optical, RF, & emerging technologies for on-chip/in-package interconnects NoC Optimization for power/energy efficiency for thermal efficiency and darksilicon for dependable architectures for communication efficient algorithms Submission Rules Electronic paper submission requires a full paper, up to 8 double-column IEEE format pages, including figures and references. The program committee in a double-blind review process will evaluate papers based on scientific merit, innovation, relevance, and presentation. Submitted papers must describe original work that has not been published before or is under review by another conference at the same time. Each submission will be checked for any significant similarity to previously published works or for simultaneous submission to other archival venues, and such papers will be rejected. Please see the paper submission instructions for details. This year will also include an industrial session on the architecture of future NoC platforms. The objective of this session is to provide a forum for industry leaders to share their experiences and perspectives on the technical challenges facing future platforms and discuss potential solutions. Check the submission page for details on submissions to this session. The session will feature a small number of papers (3-5) covering experiences from industrial design and development. Proposals for tutorials, special sessions, and panels are also invited. Please see the detailed submission instructions for paper, tutorial, special sessions, and panel proposals at the submission page. Important Dates Abstract registration deadline February 23, 2014 Full paper submission deadline May 5, 2014 Notification of acceptance March 2, 2014 Final version due June 2, 2014 Industry Session submission deadline March 23, 2014 Proposals for tutorials, special sessions and panels Jan 11, 2014 Contact Information Davide Bertozzi, University of Ferrara, davide.bertozzi@unife.it Luca Benini, University of Bologna, luca.benini@unibo.it Joerg Henkel, Karlsruhe Institute of Technology, henkel@kit.edu Sudhakar Yalamanchili, Georgia Institute of Technology, sudha@gatech.edu |
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