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IC-ICTES 2013 : The International Conference on Information and Communication Technology for Embedded Systems | |||||||||||||||
Link: http://www.icictes2013.org/ | |||||||||||||||
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Call For Papers | |||||||||||||||
Call for paper: IC-ICTES 2013
Amphawa, Samutsongkram, Thailand The 4th annual International Conference on Information and Communication Technology for Embedded Systems (IC-ICTES 2013) is to provide an international forum for researchers and industry practitioners. Our goals are to share their new ideas, original research results and practical development experiences from all embedded system-related areas including ubiquitous computing, pervasive computing, embedded system design, development of new HW/SW-related theories and techniques in embedded systems, information and communication technology for supporting development of embedded systems, and information and communication technology used in embedded systems. Proceedings will be published by TAIST Tokyo Tech Program, National Science and Technology Development Agency (NSTDA). The first page should include the paper title, the names and the complete mailing addresses of all authors, and the e-mail address of the corresponding author. Each paper should consist of up to 200-word abstract, up to 5 keywords. No page number should be printed. All the text, figures and reference must be between 4-6 double-column A4 pages with font size of 10 pts. Authors MUST use IEEE manuscript submission guidelines for their initial submissions. All papers must be submitted electronically in PDF format only, using the conference management tool. The submitted papers must not be published or under consideration to be published elsewhere. Areas: Embedded system architecture: Multiprocessors, reconfigurable platforms, memory management support, communication, protocols, network-on-chip, real-time systems, embedded Microcontrollers Real-time systems: All real-time related aspects such as software, distributed real-time systems, real-time kernels, real-time OS, task scheduling, multitasking design. Embedded hardware support: System-on-a-chip, DSPs, hardware specification, synthesis, modeling, simulation and analysis at all levels for low power, power-aware, testable, reliable, verifiable systems, performance modeling, validation, security issues, real-time behavior and safety critical systems. Embedded software: Compilers, assemblers and cross assemblers, programming, memory management, object-oriented aspects, virtual machines, scheduling, concurrent software for SoCs, distributed/resource aware OS, OS and middleware support. Hardware/software co-design: Methodologies, test and debug strategies, real-time systems, specification and modeling, design representation, synthesis, partitioning, estimation, design space exploration beyond traditional hardware/software boundary and algorithms. Testing techniques: All aspects of testing, including design-for-test, test synthesis, built-in self-test, embedded test, for embedded and system-on-a-chip systems. Application-specific processors and devices: Network processors, real-time processor, media and signal processors, application specific hardware accelerators, reconfigurable processors, low power embedded processors, bio/fluidic processors, Bluetooth, hand-held devices. Industrial practices and benchmark suites: System design, processor design, software, tools, case studies, trends, emerging technologies, experience maintaining benchmark suites, representation, interchange format, tools, copyrights, maintenance, metrics. Embedded computing education: Curriculum issues, teaching tools and methods. Emerging new topics: New challenges for next generation embedded computing systems, arising from new technologies (e.g., nanotechnology), new applications (e.g., pervasive or ubiquitous computing, embedded internet tools) and new principle (e.g., embedded Engineering). Embedded System Applications: All ranges of applications on embedded system, including speech processing, image processing, network computing, distributed computing, parallel computing and power conversion. |
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