COOL Chips is an International Symposium initiated in 1998 to present advancement of low-power and high-speed chips. The symposium covers leading-edge technologies in all areas of microprocessors and their applications. The COOL Chips XI is to be held in Yokohama on April 18-20, 2012, and is targeted at the architecture, design and implementation of chips with special emphasis on the areas listed below. All accepted papers will be published in the Proceedings of the COOL Chips XV and also included in IEEE Xplore. The COOL Chips Organizing Committee will ask the IEEE MICRO to publish selected papers in a special issue on COOL Chips XV.

Contributions are solicited in the following areas:

Low Power-High Performance Processors for Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Automotive, Networking, Medical, Healthcare, and Biometrics.
Novel Architectures and Schemes for Single Core, Multi/Many-Core, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing, GALS and Wireless.
Cool Software including Parallel Schedulers, Embedded Real-time Operating System, Binary Translations, Compiler Issues and Low Power Techniques.

Proposals should consist of a title, an extended abstract (up to 3 pages) describing the product or topic to be presented and the name, job title, address, phone number, FAX number, and e-mail address of the presenter. Please prepare the extended abstract using the given guidelines and template below.