The workshop is also meant to bring together developers and researchers from industry and academia in order to encourage cooperation. Consequently, both theoretical as well as applied research contributions are encouraged.

The topics of the Workshop include but are not limited to:

Signal Integrity
High-Speed Interconnects and high-speed channels
Power Integrity/ Ground Noise
Power Distribution Networks
Electronic packages and microsystems
3D technologies for ICs and packages
RF, Microwave packaging and mixed signal systems
Nano-Interconnects and nano-structures
Electromagnetic Theory and Modeling
Transmission Line Theory and Modeling
Macro-Modeling, reduced-order models
Advanced Simulation Tools for Signal and Power Integrity
Electromagnetic Compatibility
Coupling Effects on Interconnects
Radiation & Interference
Testing & Interconnects
Time and Frequency Domain Measurement Techniques