*** Special Session on Multimodal Signal Processing and Classification ***
*** https://tsp.vutbr.cz/documents/TSP2020_CFP_SS1_v1.pdf ***

2020 43rd International Conference on Telecommunications and Signal Processing (TSP)
July 7-9, 2020, Milan, Italy
Web: http://tsp.vutbr.cz/

Full Paper Submissions: March 15, 2020 (extended deadline)

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Technical co-sponsors: IEEE Region 8 (Europe, Middle East and Africa), IEEE Italy Section, Italy Section SP Chapter, Italy Section VT/COM Joint Chapter, IEEE Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, and Scientific Association for Infocommunications, a Sister Society of the IEEE and the IEEE Communications Society.

The TSP 2020 Proceedings, containing presented papers at the Conference, will be submitted for indexing to the IEEE Xplore® Digital Library - IEEE Conference Record #49548, SCOPUS, Conference Proceedings Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.

After the conference, authors of about 25% highest rated papers will also be invited to submit the extended version for publishing in Special Journal Issues (papers to be published after significant extension and new review process):

• Special Issue Selected Papers from the 2020 43rd International Conference on Telecommunications and Signal Processing (TSP) of an Applied Sciences (ISSN 2076-3417), an international peer-reviewed open access journal on all aspects of applied natural sciences published by MDPI and indexed by Web of Science (2018 JCR Q3; current Impact Factor: 2.217)
• International Journal of Advances in Telecommunications, Electrotechnics, Signals and Systems (IJATES) (ISSN 1805-5443), indexed by Google Scholar, CrossRef, WorldCat, EZB Elektronischen Zeitschriftenbibliothek, and Directory of Open Access Journals
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GENERAL INFORMATION:

Our experience over the world is multimodal, e.g., we see objects, hear sounds, smell odors. More precisely, we sense the environment through a multimodal and complex system. In order to build intelligent perceiving systems that analyze information acquired by sensors with different physical properties, multimodal analysis systems require powerful tools in terms of signal processing, machine learning and data mining. The implications cover a wide range of domains, from audio-visual speech recognition to multimodal human-computer interfaces and media description. Under the framework of 2020 43rd International Conference on Telecommunications and Signal Processing (TSP) held during July 7-9, 2020 in Milan, Italy, the aim of this special session is to foster the use of multimodal machine learning and data analysis tools among the signal processing community, to bridge the gap between researchers from academia and industry professionals in AI-related fields and identify possible collaborations. This special session will provide a forum of discussion on the recent advances and development experiences, with the goal of creating a synergy between signal processing and machine learning domains. Topics include but are not limited to:

• Models and methods for extracting information from multimodal data
• Applications in Computer Vision, Natural Language Processing, Spoken Language Technology, Biomedical Engineering
• Data fusion
• Machine Learning
• Deep neural networks
• Data mining
• Knowledge discovery
• Data visualization and communication

For more details please visit the Conference website at https://tsp.vutbr.cz/?page_id=4461#SS1-20 .

EDITORIAL BOARD:

• Prof. Corneliu Burileanu (University Politehnica of Bucharest, Romania; E-mail: corneliu.burileanu@upb.ro)
• Dr. Anamaria Radoi (University Politehnica of Bucharest, Romania; E-mail: anamaria.radoi@upb.ro)

STUDENT BEST PAPER AWARD:

In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to recognize outstanding technical contributions by students, as evidenced by the quality of papers, their presentations, and their technical excellence, the authors of the Best 5 Student Papers will be awarded during the conference by the Technical Committee. The Best Student Paper Award consists in a Plaque and a Certificate of Appreciation.

TSP ORGANIZERS:

The TSP 2020 is IEEE technically co-sponsored Conference organized in cooperation with eighteen universities:

• Brno University of Technology, Department of Telecommunications, Brno, Czech Republic
• Budapest University of Technology and Economics, Department of Telecommunications and Media Informatics, Budapest, Hungary
• Czech Technical University in Prague, Department of Telecommunication Engineering, Prague, Czech Republic
• Isik University, Department of Electrical and Electronics Engineering, Sile/Istanbul, Turkey
• Istanbul Technical University, Electronics and Communication Engineering Department, Istanbul, Turkey
• Josip Juraj Strossmayer University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology Osijek, Osijek, Croatia
• Karadeniz Technical University, Department of Electrical and Electronics Engineering, Trabzon, Turkey
• National Taiwan University of Science and Technology, Department of Electronic and Computer Engineering, Taipei, Taiwan
• Seikei University, Graduate School and Faculty of Science and Technology, Information Networking Laboratory, Tokyo, Japan
• Slovak University of Technology in Bratislava, Institute of Multimedia Information and Communication Technologies, Bratislava, Slovak Republic
• Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain
• Technical University of Sofia, Faculty of Telecommunications, Sofia, Bulgaria
• Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de Saint-Denis (LIASD), France
• University “Politehnica” of Bucharest, Center for Advanced Research on New Materials, Products and Innovative Processes (“CAMPUS”)
• University of Ljubljana, Laboratory for Telecommunications, Ljubljana, Slovenia
• University of Patras, Physics Department, Patras, Greece
• VSB - Technical University of Ostrava, Department of Telecommunications, Ostrava, Czech Republic
• West Pomeranian University of Technology, Faculty of Electrical Engineering, Szczecin, Poland

IMPORTANT DATES:

• Full Paper Submissions: March 15, 2020 (extended deadline)
• Notification of Paper Acceptance: April 15, 2020
• Final Paper Submission: April 30, 2020
• Authors' Early Registration and Payment: May 10, 2020
• Authors' Late Registration and Payment: May 20, 2020

CONTACTS:

Web: http://tsp.vutbr.cz/
E-mail: tsp@feec.vutbr.cz

Follow us on:
• Facebook https://www.facebook.com/tspconf/
• Twitter https://twitter.com/tspconf/

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TSP Organizers reserve the right to exclude a paper from distribution after the Conference (e.g., non-indexing in IEEE Xplore® and other databases) if the paper is not presented at the Conference.
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