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MTD 2012 : 3rd International Workshop on Managing Technical Debt | |||||||||||||||
Link: http://www.sei.cmu.edu/community/td2012/ | |||||||||||||||
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Call For Papers | |||||||||||||||
CALL FOR PAPERS
***************************************************************** 3rd International Workshop on Managing Technical Debt (MTD 2012) http://www.sei.cmu.edu/community/td2012/ June 5, 2012 Zurich, Switzerland In conjunction with the 34th Int. Conf. on Software Engineering (ICSE 2012) www.ifi.uzh.ch/icse2012 Zurich, Switzerland, June 2-9, 2012 ***************************************************************** IMPORTANT DATES Submission Deadline: Feb 17, 2012 Acceptance Notification: March 19, 2012 Camera-Ready Version: March 29, 2012 Workshop: June 5, 2012 ***************************************************************** Delivering complex, large-scale systems faces the ongoing challenge of how best to balance rapid deployment with long-term value. The technical debt metaphor is gaining significant traction in the software development community, as a way to understand and communicate issues of intrinsic quality, value, and cost. The idea is that developers sometimes accept compromises in a system in one dimension (e.g., modularity) to meet an urgent demand in some other dimension (e.g., a deadline), and that such compromises incur a debt on which interest has to be paid and which should be repaid at some point for the long-term health of the project. There is increasing necessity to address theoretical foundations and empirical evidence for analyzing and optimizing short-term versus long-term goals in large scale projects. The goal of this third workshop is to discuss managing technical debt as a part of the research agenda for the software engineering field, in particular focusing on eliciting and visualizing debt and creating payback strategies. MTD 2012 seeks contributions addressing, but not limited to, the following topics: * Techniques for identifying and monitoring technical debt * Types of technical debt in industrial settings * Key parameters that help elicit, communicate, and manage technical debt quantitatively * Lifetime of technical debt * Relationship of technical debt to code quality and defect analysis * Technical debt throughout the software development lifecycle * Relationship of technical debt to evolution and maintenance activities * Empirically collecting information about technical debt * Measurement and payoff strategies for technical debt * Metrics for analyzing technical debt * Visualization of technical debt * Using technical debt strategically * Relationship of technical debt to different software development activities (requirements debt, architectural debt, testing debt) SUBMISSIONS We invite submissions of papers in any areas related to the themes and goals of the workshop in the following categories: 1. research papers-describing innovative and significant original research in the field (8 pages) 2. industrial papers-describing industrial experience, case studies, challenges, problems and solutions (8 pages) 3. position and future trend papers-describing ongoing research, new results, and future trends (4 pages) Contributors are requested to submit their papers through EasyChair; https://www.easychair.org/conferences/?conf=mtd2012 Please visit http://www.sei.cmu.edu/community/td2012/ for further information. ORGANIZERS Philippe Kruchten, University of British Columbia, Canada Rod Nord, Software Engineering Institute, USA Ipek Ozkaya, Software Engineering Institute, USA Joost Visser, Software Improvement Group, Netherlands PROGRAM COMMITTEE Eric Bouwers, Technical University Delft, Netherlands Yuangfang Cal, Drexel University, USA Rafael Capilla, Universidad Rey Juan Carlos, Spain Jeromy Carriere, eBay, USA Bill Curtis, CAST, USA Hakan Erdogmus, Kalemun Research, Canada David Garlan, Carnegie Mellon University, USA Israel Gat, Cutter Consortium, USA Matthew Heusser, Socialtext, USA Jim Highsmith, ThoughtWorks, USA Rick Kazman, University of Hawaii and the Software Engineering Institute, USA Erin Lim, University of British Columbia, Canada Alan MacCormack, MIT, USA Don O'Connell, Boeing, USA Raghu Sangwan, Penn State University, USA Carolyn Seaman, University of Maryland, USA Kevin Sullivan, University of Virginia, USA Peri Tarr, IBM, USA Ted Theodoropoulus, Acrowire, USA |
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