10^th International Conference on Electrical Engineering (ELE 2026)

October 30 ~ 31, 2026, Virtual Conference

Scope & Topics

10^th International Conference on Electrical Engineering (ELE 2026) aims to bring together researchers and practitioners from academia and industry to focus on recent systems and techniques in the broad field of Electrical Engineering. Original research papers, state-of-the-art reviews are invited for publication in all areas of Electrical Engineering.

Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the following areas, but are not limited to:

Topics of interest include, but are not limited to, the following

Communication and Networking


• Communication Systems and Wireless Technologies
  
• 5G/6G Networks, Massive MIMO and THz Communications
  
• Reconfigurable Intelligent Surfaces (RIS) for 6G
  
• Semantic Communications and Goal‑Oriented Networking
  
• Integrated Sensing and Communication (ISAC)
  
• AI‑Native Wireless Networks and Neural Modulation
  
• Cell‑Free Massive MIMO and Distributed Antenna Systems
  
• IoT, Edge Networks and Cyber‑Physical Connectivity
  
• Satellite, UAV and Non‑Terrestrial Networks
  
• Open RAN (O‑RAN) and Virtualized Radio Access Networks
  
• Quantum‑Safe Communication and Post‑Quantum Cryptography
  
• Network Security, Privacy and Resilient Communication
  
  Control, Automation and Robotics
  
  
• Control Systems and Intelligent Automation
  
• Robotics, Mechatronics and Autonomous Systems
  
• Distributed Control for Multi‑Robot Systems
  
• Safety‑Critical Control for Autonomous Systems
  
• AI‑Driven Motion Planning and Safe Autonomous Navigation
  
• Nonlinear, Adaptive and Robust Control
  
• Electrified Soft Actuators and High‑Power Robotics Drives
  
• Robotics for Extreme Environments
  
• Robotics‑Integrated Power Electronics
  
• Cyber‑Physical Systems, Digital Twins and Industrial Automation
  
  Electromagnetics, Photonics and Quantum Technologies
  
  
• Electromagnetics, RF Systems and Microwave Engineering
  
• Photonics, Optoelectronics and Photonic Integrated Circuits
  
• Silicon Photonics and CMOS‑Compatible Photonic ICs
  
• Topological Photonics and Protected Light Transport
  
• Antennas, Wave Propagation and Metamaterials
  
• Quantum Devices, Quantum Sensors and Quantum Communication
  
• Quantum Photonics and Integrated Quantum Circuits
  
• Quantum RF Systems and Cryo‑Microwave Engineering
  
• High‑Frequency Devices and Terahertz Systems
  
• Optical Neural Networks and Photonic AI Accelerators
  
• Inverse Design for Photonics and EM Structures
  
• High‑Power Microwave Systems and Directed Energy
  
  High Voltage, Power Electronics and Power Systems
  
  
• High Voltage Engineering and Insulation Systems
  
• Power Electronics, Converters and Drives
  
• Wide‑Bandgap Devices (GaN, SiC) for High‑Efficiency Power Conversion
  
• AI‑Driven Power Converter Design and Digital Control
  
• EV Power Electronics, Charging Systems and Mobility Electrification
  
• Power Electronics for Fusion Reactors
  
• Smart Grids, Grid Resilience and Renewable Integration
  
• Grid‑Forming Inverters and Future Power Grid Stability
  
• Resilient Microgrids and Autonomous Grid Restoration
  
• Power Systems Protection, Stability and Optimization
  
• Solid‑State Transformers and Smart Substations
  
• Energy Storage, Battery Management and Power Quality
  
• Electrified Transportation Infrastructure and Vehicle‑to‑Grid (V2G)
  
• High‑Frequency Power Conversion (MHz‑Range)
  
  Signal Processing, Systems Science and Imaging
  
  
• Systems Science and Signal Processing
  
• AI‑Accelerated Signal Processing and Edge Intelligence
  
• Spiking Neural Signal Processing and Event‑Based Sensing
  
• Graph Signal Processing and Networked Data Analysis
  
• Multimodal Sensing Fusion (RF + Vision + Audio)
  
• RF‑Vision Fusion (Radar + Vision Transformers)
  
• Image Processing, Multimedia and Computer Vision
  
• Computational Imaging and Compressive Sensing
  
• Biomedical Imaging, Medical Signal Analysis and Diagnostics
  
• Speech, Audio and Acoustic Signal Processing
  
• AI‑Driven Spectrum Sensing and Cognitive Radio 2.0
  
• AI‑Driven Compression, Coding and Multimedia Systems
  
  Nano Devices, Integrated Systems and Emerging Electronics
  
  
• Nano Devices, Nanoelectronics and Integrated Systems
  
• Semiconductor Devices, VLSI and Advanced IC Design
  
• 3D ICs, TSVs and Heterogeneous Integration
  
• Chiplet Architectures and Advanced Packaging
  
• Cryogenic Electronics for Quantum Computing
  
• Quantum‑CMOS Co‑Design and Hybrid Classical–Quantum Chips
  
• Ferroelectric FETs (FeFETs) and Next‑Gen Non‑Volatile Memory
  
• Spintronics, Magnetic Memory and MRAM
  
• In‑Memory Computing and Analog AI Accelerators
  
• Flexible Electronics, Wearable Sensors and Bio‑Integrated Devices
  
• Electronic Packaging, Reliability and Thermal Management
  
  Instrumentation, Embedded Systems and Industrial Electronics
  
  
• Measurements, Instrumentation and Sensor Systems
  
• High‑Precision Metrology and Quantum Sensors
  
• Digital Metrology and AI‑Enhanced Calibration
  
• Embedded Systems, Real‑Time Systems and FPGA Applications
  
• Ultra‑Low‑Power Analog Front‑Ends for Edge AI
  
• Industrial Automation, SCADA and Process Control
  
• Electromechanical Systems and Industrial Electronics
  
• Industrial IoT, SCADA Security and OT Cyber‑Resilience
  
• Digital Twins for Industrial Monitoring
  
  Emerging Electrical Engineering Domains
  
  
• Cybersecurity for Electrical and Industrial Systems
  
• Electromagnetic Compatibility (EMC) and Interference Mitigation
  
• Sustainable Energy Systems and Electrification Technologies
  
• AI for Electrical Engineering, Optimization and Automation
  
• Recent Trends, Breakthroughs and Future Directions
  

Paper Submission

Authors are invited to submit papers through the conference Submission System by August 31, 2026. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by The proceedings of the conference will be published by International Journal on Cybernetics & Informatics (IJCI) series (Confirmed).

Selected papers from ELE 2026, after further revisions, will be published in the special issue of the following journals.

• Electrical & Computer Engineering: An International Journal (ECIJ)
  
• Electrical Engineering: An International Journal (EEIJ)
  
• Circuits and Systems: An International Journal (CSIJ)
  
• Electrical and Electronics Engineering: An International Journal (ELELIJ)
  

Important Dates

Co - Located Event

• 4^th International Conference on Blockchain, Cybersecurity and Internet of Things (BCYIoT 2026)
  
• 4^th International Conference on Education & Integrating Technology (EDIT 2026)
  
• 4^th International Conference on AI, Data Mining and Data Science (AIDD 2026)
  
• 4^th International Conference on Computer Science and Information Technology Advances (CCSITA 2026)
  
• 4^th International Conference on Clinical and Medical Sciences (CAMS 2026)
  
• 4^th International Conference on NLP, AI & Information Retrieval (NLAII 2026)
  
• 9^th International Conference on Mechanical Engineering & Applications (MEAP 2026)
  
• 4^th International Conference on Vision Computing (VISCOM 2026)
  
• 4^th International Conference on Semantic Technology (SEMTEC 2026)
  

***** The invited talk proposals can be submitted to ele@ele2026.org