| |||||||||||||||
RSP 2012 : 23rd IEEE International Symposium on Rapid System PrototypingConference Series : Rapid System Prototyping | |||||||||||||||
Link: http://www.rsp-symposium.org | |||||||||||||||
| |||||||||||||||
Call For Papers | |||||||||||||||
The International Symposium on Rapid System Prototyping (RSP) considers prototyping as an iterative design approach for embedded hardware and software systems. The RSP series of symposium aims at bridging the gap among embedded design tools and processes, engineering methods, processes & tools, to achieve the rapid system prototyping of actual software and hardware systems.
RSP emphasizes collaborative approach toward embedded system design between industrial and academic, hardware and software communities. The symposium proposes a two-day forum for discussion with a focus on technical presentations, completed with keynote speakers and a panel discussion. For its 23rd venue, the Rapid System Prototyping Symposium seeks original contributions that address theoretical and practical methodologies, new approach for specification, completeness, dynamics of change, technology insertion, complexity, integration, and time to market. In 2012, the RSP symposium is part of the Embedded Systems Week, in Tampere, Finland. See http://www.esweek.org for more details. Suggested topics include, but are not limited to: -Multiprocessor System on Chip design challenges -Embedded System Architecture Integration -Real Time embedded system challenges -Specification and Language Models for hardware/software systems -Methodologies and Tools for hardware/ software systems -Embedded System verification/validation -Design of Critical Embedded Systems -Reliability and failure analysis for embedded systems -Emerging Technologies and Applications -Quality in embedded systems design -Educational Hardware and Software Tools and Techniques -Trends in Engineering Education -Model Driven Engineering and prototyping -Virtual prototyping of physical systems -Specification to product transition -Industrial Designs The program committee invites authors to submit original, previously unpublished full papers. Authors of selected papers will be requested to prepare a manuscript for the symposium proceedings. Paper length should not exceed 7 pages in the standard IEEE format. Submission instructions as well astemplates can be found on the RSP web site. The program committee also invites tutorial speakers for giving lectures on RSP topics, for both academic and industrial attendees. For more detailed information, please contact the Tutorial Chair. Important Dates: Paper submission: June 1st, 2012 Notification of Acceptance: July 2, 2012 Final Camera Ready Manuscript due: July 27, 2012 For any submission question, please contact: Fabiano Hessel, PUCRS – fabiano.hessel@pucrs.br Jérôme Hugues, ISAE – jerome.hugues@isae.fr Frédéric Rousseau, TIMA – Frederic.Rousseau@imag.fr Paper submission Electronically submit all papers using: http://www.easychair.org/conferences/?conf=rsp2012 Here are the guidelines from the IEEE. Please follow them carefully. http://www.ieee.org/web/publications/authors/transjnl/index.html For any submission question, please contact the general chair. |
|