posted by user: Moustafa_Kassem || 4494 views || tracked by 4 users: [display]

eMDC & ISSM 2011 : e-Manufacturing & Design Collaboration Symposium & International Symposium on Semiconductor Manufacturing (eMDC & ISSM)

FacebookTwitterLinkedInGoogle

Link: http://www.tsia.org.tw/Seminar/eManufacturing/2011/
 
When Sep 5, 2011 - Sep 6, 2011
Where Hsinchu, Taiwan
Submission Deadline Jun 1, 2011
Notification Due Jun 20, 2011
Final Version Due Jul 27, 2011
Categories    semiconductor   manufacturing   e-manufacturing
 

Call For Papers

In collaboration with ISSM, this joint Symposium attends to recent technological advancements to align the needs of designers, manufacturers, equipment suppliers, software vendors, solution providers and researchers. It offers a public arena for the exchange of up-to-date experiences among manufacturers for adoption of technological developments. With green notions of supply/engineering/value chains, coverage of the joint symposium includes, but not limited to, the following topics of interests:

* Advanced Lithography
* Benefits and Justification (ROI, CoO, OEE ...)
* Contamination Control and Ultraclean Technology
* Control Architecture/Engineering/IT Infrastructure
* Cross-industrial Applications of PV/SSL/FPD/…
* Data Collection/Quality/Storage/Management
* Design for Manufacturing/Testing/Yield
* e-Diagnostics, e-Manufacturing, and EEC
* Engineering/Supply/Value Chains
* Environment, Safety and Health
* Equipment Control/Integration
* Fab Management/Scheduling/Dispatching
* Factory Design & Automated Material Handling
* Factory Integration/Operations
* Factory Physics & Queueing Operations
* Fault Detection/Classification and Sensors
* Final/Lean/Green Manufacturing
* Manufacturing Control and Execution Systems
* Manufacturing Strategy and Operation Management
* Next Generation Factory & 450mm Wafers
* Predictive/Preventive Maintenance
* Process and Material Optimization
* Process and Metrology Equipment
* Process Control and Monitoring
* Process Modeling and Model-Based Simulations
* Process/Tool/Sensor Integrations
* Standards (Equipment, Communications, …)
* Through Silicon Via & 3D Structures
* Ultra High Productivity in High-Volume Manufacturing
* Yield Enhancement and WIP Management

Related Resources

RECAP_OCT 2025   Research in Education Curriculum and Pedagogy: Global Perspectives (RECAP) Special Section : Curriculum Design, Student Mobility & Employability and Good Practices Call for Paper
MSEJ 2025   Advances in Materials Science and Engineering: An International Journal
SGEM Vienna Green 2025   SWS Vienna GREEN 2025 „Green Science for Green Life“ - International Scientific Conference on Earth & Planetary Sciences
IEEE-EI/Scopus-ISF 2025   2025 Information Science Frontier Forum and the Academic Conference on Information Security and Intelligent Control-IEEE Xplore/EI/Scopus
ACE 2025   The 17th Asian Conference on Education (ACE2025)
EI/Scopus-ICDSIC 2025   2025 International Conference on Digital Society and Intelligent Computing-EI/Scopus
UPADSD 2025   Urban Planning & Architectural Design for Sustainable Development (UPADSD) – 10 Edition
IEEE-EI/Scopus-ETAE 2025   2025 2nd International Conference on Electrical Technology and Automation Engineering-EI/Scopus
ISCMI 2025   2025 12th International Conference on Soft Computing & Machine Intelligence (ISCMI 2025)
EduTeach 2025   9th Canadian Conference on Advances in Education, Teaching & Technology 2025