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ESWEEK 2023 : Embedded Systems Week | |||||||||||||||
Link: http://www.esweek.org | |||||||||||||||
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Call For Papers | |||||||||||||||
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EMBEDDED SYSTEMS WEEK Call for Papers: CASES, CODES+ISSS, EMSOFT, MEMOCODE, NOCS Call for Proposals: Workshops, Tutorials, Educations, Special Sessions Hamburg, Germany, September 17-22, 2023 www.esweek.org ========================================================================= ------------------------------------------------------------------------- About Embedded Systems Week (ESWEEK) ------------------------------------------------------------------------- Embedded Systems Week (ESWEEK) is the premier event covering all aspects of hardware and software design for smart, intelligent and connected computing systems. By bringing together three leading conferences (CASES, CODES+ISSS, EMSOFT), two symposia (MEMOCODE, NOCS), and several workshops and tutorials, ESWEEK allows attendees to benefit from a wide range of topics covering the state of the art in embedded systems research and development. https://esweek.org/cfp_esweek/ Registered attendees can attend sessions in any of the ESWEEK conferences (CASES, CODES+ISSS, EMSOFT). Please note that tutorials, symposia (MEMOCODE, NOCS), and workshops may use separate registration. ------------------------------------------------------------------------- Timeline ------------------------------------------------------------------------- Journal Track: - Abstract Submission: March 16, 2023 (AoE) - Full Paper Submission: March 23, 2023 (AoE, firm) - Notification of Acceptance: June 30, 2023 Late-Braking (LB) Results and Work-in-Progress (WiP) Track: - Paper Submission: May 22, 2023 (AoE, firm) - Notification of Acceptance: June 19, 2023 Proposals of Workshops, Tutorials, Education Classes, and Special Sessions: March 20, 2023 ------------------------------------------------------------------------- Covid-19 planning ------------------------------------------------------------------------- ESWEEK 2023 will be an in-person event, taking place in Hamburg, Germany. We will continue to monitor specific travel advisories through official channels, which include the World Health Organization (WHO) and the local Ministry of Health. Please refer to the conference web-site and social media channels for updates. ------------------------------------------------------------------------- Call for LB and WIP Papers ------------------------------------------------------------------------- ESWEEK’23 introduces a new track: Late-Breaking (LB) Results papers. LB papers provide a venue for quick dissemination of research ideas to the embedded systems community and are expected to represent complete and mature works written in a condensed form. Work-in-Progress (WIP) papers are intended as a venue to report early or ongoing research activities representing work that has not been fully realized or developed, for which full empirical data may not yet be available, or that has not yet reached a level of maturity expected for other types of submissions. ESWEEK invites you to submit up to 4 pages of original research articles for LB and WIP papers. Both LB and WIP papers will go through 2 rounds of reviews. If accepted, the LB papers will be published in IEEE ESL (Embedded Systems Letters), while WIP papers will be published in ESWEEK proceedings of the respective conferences. The authors of accepted LB and WIP papers will present a poster of their work, and a lightning talk at ESWEEK. Authors of accepted LB papers will also need to submit a 3-minute video when submitting the final camera-ready version of the paper. When submitting an LB/WIP paper, please follow the appropriate conference submission site. ------------------------------------------------------------------------- Review Process ------------------------------------------------------------------------- ESWEEK 2023 continues a dual publication model comprising the Journal track and the Work-in-Progress (WiP) track. Journal track papers, which are full-length papers describing mature work, will be published in the ACM Transactions on Embedded Computing Systems (TECS). The WiP track papers, which are short (2-page) papers representing not-yet-mature but promising research, will be published in the ESWEEK proceedings and will be listed as regular publications within the IEEE and/or ACM digital libraries. Authors of WiP papers have the opportunity to publish the extended form of their work in any conference or journal they prefer. Journal and WiP papers are mutually exclusive, i.e., a work can only be in submission in one of the two tracks. For more information on the publishing process, refer to: https://esweek.org/author-information/ ------------------------------------------------------------------------- CASES: International Conference on Compilers, Architectures, and Synthesis for Embedded Systems ------------------------------------------------------------------------- CASES is a premier forum where researchers, developers and practitioners exchange information on the latest advances in compilers and architec- tures for high-performance, low-power embedded systems. The conference has a long tradition of showcasing leading edge research in embedded processor, memory, interconnect, storage architectures and related compiler techniques targeting performance, power, predictability, security, reliability issues for both traditional and emerging application domains. In addition, we invite innovative papers that address design, synthesis, and optimization challenges in heterogeneous and accelerator-rich architectures. https://esweek.org/cases/ CASES Program Chairs: Swarup Bhunia, University of Florida, US Jana Doppa, Washington State University, US ------------------------------------------------------------------------- CODES+ISSS: International Conference on Hardware/Software Codesign and System Synthesis ------------------------------------------------------------------------- The International Conference on Hardware/Software Co-design and System Synthesis is the premier event in system-level design, modeling, analysis, and implementation of modern embedded and cyber-physical systems, from system-level specification and optimization down to system synthesis of multi-processor hard-ware/software implementations. The conference is a forum bringing together academic research and industrial practice for all aspects related to system-level and hardware/software co-design. https://esweek.org/codes-isss/ CODES+ISSS Program Chairs: Mohammad Abdullah Al Faruque, UC Irvine, US Muhammad Shafique, New York University, US ------------------------------------------------------------------------- EMSOFT: International Conference on Embedded Software ------------------------------------------------------------------------- The ACM SIGBED International Conference on Embedded Software (EMSOFT) brings together researchers and developers from academia, industry, and government to advance the science, engineering, and technology of embedded software development. Since 2001, EMSOFT has been the premier venue for cutting-edge research in the design and analysis of software that interacts with physical processes, with a long-standing tradition for results on cyber-physical systems, which compose computation, networking, and physical dynamics. https://esweek.org/emsoft/ EMSOFT Program Chairs: Clarie Pagetti, Onera/ENSEEIHT, FR Alessandro Biondi, Scuola Superiore Sant'Anna, IT ------------------------------------------------------------------------- MEMOCODE: International Symposium on Formal Methods and Models for System Design ------------------------------------------------------------------------- MEMOCODE focuses on formal methods and models for developing computer systems and their components. MEMOCODE’s objective is to emphasize the importance of models and methodologies in correct system design and development. https://esweek.org/memocode/ ------------------------------------------------------------------------- NOCS: International Symposium on Networks-on-Chip ------------------------------------------------------------------------- NOCS is the premier event dedicated to interdisciplinary research on on-chip, package-scale, chip-to-chip, and datacenter rack-scale communication technology, architecture, design methods, applications, and systems. https://esweek.org/nocs/ ------------------------------------------------------------------------- Call for Workshop Proposals ------------------------------------------------------------------------- ESWEEK 2023 is soliciting proposals for new and recurring workshops to be held on September 21/22. Proposals for half-day to two-day workshops on a broad range of topics relevant to research, education, and design are welcome. Details can be found at: https://esweek.org/wp-content/uploads/2023/01/CFW-ESWEEK2023.pdf Workshop Chair: Robert Dick, University of Michigan, US ------------------------------------------------------------------------- Call for Tutorial Proposals ------------------------------------------------------------------------- ESWEEK 2023 is looking for high-quality tutorials that will take place on Sunday, September 17, 2023. Tutorials on all topics related to embedded system design, analysis, and development are welcome. Tutorials can be either half/full-day, lecture style or hands-on. Tutorials Chair: Akash Kumar, Technische Universität Dresden, DE ------------------------------------------------------------------------- Call for Education Proposals ------------------------------------------------------------------------- ESWEEK 2023 will host several education lectures virtually on September 14 and 15, and is soliciting proposals for such lectures. The theme of this year’s Education lectures is "Domain-Specific Hardware and Software". We invite you to submit education proposals on a topic related to this theme. https://esweek.org/wp-content/uploads/2023/01/CFE-ESWeek2023.pdf Education Chairs: Anup Das, Drexel University, US Qingfeng (Karen) Zhege, East China Normal University, CN ------------------------------------------------------------------------- Call for Special Session Proposals ------------------------------------------------------------------------- We invite you to submit special session proposals on any topic relevant to the broad areas of interest of ESWEEK. The special session should cover a topic that is contemporary, hot, and complementary to the regular sessions. The special session should be able to generate enthusiasm among the ESWEEK participants. Special Sessions Chair: Sri Parameswaran, University of New South Wales, AU ------------------------------------------------------------------------- Special Day Topic: Global Semiconductor Renaissance ------------------------------------------------------------------------- The semiconductor industry and research are garnering tremendous interest worldwide. Embedded computing plays a key role in modern digital systems and that role will grow with the semiconductor renaissance. ESWEEK 2023 welcomes proposals on special sessions, panels, workshops, tutorials, and education classes that explore the embedded computing’s role in the future of semiconductors and electronics. Panel and Special Day Chair: Marilyn Wolf, University of Nebraska-Lincoln, US ------------------------------------------------------------------------- Call for Ph.D. Forum Submissions ------------------------------------------------------------------------- The Ph.D. Forum at ESWEEK 2023 is a poster session with lightning talks for Ph.D. students to present their dissertation research with the embedded systems community, and will be hosted together with a job fair, offering great opportunities for networking. The forum is open to all members of the embedded systems community and is free-of-charge. For Ph.D. students presenting posters in this Forum, limited funds will be available for travel assistance, based on financial needs. Ph.D. Forum Chair: Xue Lin, Northeastern University, USA ------------------------------------------------------------------------- Organization ------------------------------------------------------------------------- ESWEEK 2023 General Chairs: Xiaobo Sharon Hu, University of Notre Dame, US (General Chair) Alain Girault, INRIA, FR (Vice General Chair) Conference and Local Arrangement Chair: Heiko Falk, Hamburg University of Technology, DE www.esweek.org |
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