The 17th Annual IEEE International Conference on Advanced Thermal Processing of Semiconductors - RTP 2009 will be held in Marriott Hotel in Albany, NY during September 29 - October 2, 2009. The Conference will address up-to-date multidisciplinary research aspects of thermal processing of semiconductors and production needs of the state-of-the-art of semiconductor manufacturing. The program includes invited and submitted oral presentations. The Conference is accompanied by tutorial workshop "Metrology for ion-implant and diffusion engineering."


Conference Chair:
Bo Lojek
ATMEL

Local Chair:
Alain C. Diebold
College of Nanoscale Science and Engineering

Regional Chairs:

Europe America Far East
Vittorio Privitera Jeff Gelpey Kyoichi Suguro
IMM CNR Mattson Technology Toshiba


Keynote Address

Devendra Sadana
Manager, Advanced Substrate Research
IBM - T.J. Watson Research Center
Yorktown Heights, NY


IEEE RTP2009 Conference - Workshop

Workshop Chair:

Michael Current
Current Scientific


Device performance and in-line process control requirements for annealing of 45/32 nm CMOS
A. C. Deibold, SUNY Albany

Reflectivity probes of doping and damage (MOR, BX)
A. Salnik, KLA

Carrier recombination and lifetime probes (RsL, MOR, PL, Qs, SPV)
M. Current, Current Scientific

Ellipsometric characterization of disorder created by ion-implantation
P.Petrik, T. Lohner, O. Polgar, M. Fried, MTA-MFA

m-PCD lifetime measurement of ion-implanted and annealed layers
R. Ahrenkiel, School of Mines, Golden

CV measurements
B. Gordon, MDC

Important Dates

Abstract Submission Deadline: May 31, 2009
Abstracts Review Period: June 1, 2008 - June 14, 2009
Notification of Acceptance: June 15, 2009
Final Paper Submission Deadline: August 31, 2009