The International Symposium on Quality Electronic Design (ISQED) is the leading Electronic Design & Design Automation conference, aimed at bridging the
gap among electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design quality. ISQED is the pioneer
and leading international conference dealing with design for manufacturability and quality issues front-to-back. ISQED emphasizes a holistic approach toward
electronic design and intends to highlight and accelerate cooperation among the IC Design, EDA, Semiconductor Process Technology and Manufacturing
communities. ISQED spans three days, Monday through Wednesday, in three parallel tracks, hosting over100 technical presentations, several keynote speakers,
panel discussions, workshops/tutorials and other informal meetings. Conference proceedings are published by IEEE and posted in the digital library. Proceedings
CD ROMs are published by ACM. In addition, continuing the tradition of reaching a wider readership in the IC design community, ISQED will continue to
publish special issues in leading journals. The authors of high quality papers will be invited to submit an extended version of their papers for the special IEEE
journal issues, such as TCAD, etc.

Papers are requested in the following areas

Design for Manufacturability/Yield & Quality (DFM/DFY/DFQ)

DFM/DFY/DFQ definitions, methodologies, matrices, and standards. Quality-based design methodologies and flows for custom, semi-custom,
ASIC, FPGA, RF, memory, networking circuit, etc. Design flows and methodologies for SoC, and SiP. Analysis, modeling, and abstraction of
manufacturing process parameters and effects for highly predictable silicon performance. Design and synthesis of ICs considering factors such
as: signal integrity, transmission line effects, OPC, phase shifting, and sub-wavelength lithography, manufacturing yield and technology
capability. Design for diagnosability, defect detection and tolerance; self-diagnosis, calibration and repair. Design and manufacturabilty issues
for Digital, analog, mixed signal, RF, MEMS, opto-electronic, biochemical-electronic, and nanotechnology based ICs. Redundency and other yield
improving techniques. Global, social, and economic implications of design quality.

Physical Design, Methodologies & Tools (PDM)

Physical design for manufacturing; Physical synthesis flows for correct-by-construction quality silicon, implementation of large SoC designs.
Tool frameworks and data-models for tightly integrated incremental synthesis, placement, routing, timing analysis and verification. Placement,
optimization, and routing techniques for noise sensitivity reduction and fixing. Algorithms and flows for harnessing crosstalk-delay during
physical synthesis. Tool flows and techniques for antenna rule and electromigration rule avoidance and fixing. Spare-cell strategies for ECO,
decoupling capacitance and antenna rule fixing. Physical planning tools for predictable power-aware circuits. Reliable clock tree generation
and clock distribution methodologies for Gigahertz designs. EDA tools, design techniques, and methodologies, dealing with issues such as:
timing closure, R, L, C extraction, ground/Vdd bounce, signal noise/cross-talk /substrate noise, voltage drop, power rail integrity, electromigration,
hot carriers, EOS/ESD, plasma induced damage and other yield limiting effects, high frequency effects, thermal effects, power estimation, EMI/
EMC, proximity correction & phase shift methods, verification (layout, circuit, function, etc.).

Design Verification and Design for Testability (DVFT)

Hardware and Software, Formal and simulation based design verification techniques to ensure the functional correctness of hardware early
in the design cycle. DFT and BIST for digital and SoC. DFT for analog/mixed-signal ICs and systems-on-chip, DFT/BIST for memories. Test
synthesis and synthesis for testability. DFT economics, DFT case studies. DFT and ATE. Fault diagnosis, IDDQ test, novel test methods,
effectiveness of test methods, fault models and ATPG, and DPPM prediction. SoC/IP testing strategies. Design methodologies dealing with the
link between testability and manufacturing.

EDA Methodologies, Tools, Flows & IP Cores; Interoperability and Reuse(EDA)

EDA tools addressing design for manufacturing, yield, and reliability. Management of design process, design flows and design databases. EDA
tools interoperability issues and implications. Effect of emerging technologies, processes & devices on design flows, tools, and tool interoperability.
Emerging EDA standards. EDA design methodologies and tools that address issues which impact the quality of the realization of designs into
physical integrated circuits. IP modeling and abstraction. Design and maintenance of technology independent hard and soft IP blocks. Methods
and tools for analysis, comparison and qualification of libraries and hard IP blocks. Challenges and solutions of the integration, testing,
qualifying, and manufacturing of IP blocks from multiple vendors. Third party testing of IP blocks. Risk management of IP reuse. IP authoring
tools and methodologies.

Robust & Power-conscious Devices, Interconnects, and Circuits (PCC)

Power-conscious design methodologies and tools; low power devices, circuits and systems; power-aware computing and communication;
system-level power optimization and management. Design techniques for leakage current management.

Emerging/Innovative Process & Device Technologies and Design Issues (EDT)

Emerging processes & device technologies and implications on IC design with respect to design's time to market, yield, reliability, and quality.
Emerging issues in DSM CMOS: e.g. sub-threshold leakage, gate leakage, technology road mapping and technology extrapolation techniques.
New and novel technologies such as SOI, Double-Gate (DG)-MOSFET, Gate-All-Around (GAA)-MOSFET, Vertical-MOSFET, strained CMOS, highbandwidth
metallization, 3D integrated circuits, nanodevices, etc.

Package - Design Interactions & Co-Design (PDI)

Concurrent circuit, package, and PCB/PWB design and effect on quality. EDA tools and methodologies dealing with the IC Packaging electrical
and thermal modeling and simulation for improved quality of product. SoC versus system in a package (SiP): design and technology solutions
and tradeoffs; MCM, BGA, Flip Chip, and other innovative packaging techniques for various applications such as mixed-signal and RFIC.

Design of Reliable Circuits and Systems (DFR)

Device and process reliability issues and effect on design of reliable circuits and systems. ESD design for digital, mixed signal and RF
applications. Exploration of critical factors such as noise, substrate coupling, cross-talk and power supply noise. Significance and trends in
process reliability effects such as gate oxide integrity, electromigration, ESD, etc., and their relation to electronic design.

System-level Design, Methodologies & Tools (SDM)

Emerging system-level design paradigms, methods and tools aiming at quality. ESL design process and flow management. System-level design
modeling, analysis, synthesis, estimation and verification for correct high-quality hardware/software systems. Development of reliable, responsive,
secure, manufacturable, and defect-tolerant systems. New concepts, methods and tools addressing the hardware and system design
complexity, multitude of aspects, manufacturability, and usage of technology information and manufacturing feedback in the system-, RTLand
logic level design. The influence of the nanometer technologies' issues on the system-, RTL- and logic-level design. System-level trade-off
analysis and multi-objective (yield, power, delay, area) optimization. Effective and efficient development, implementation, analysis and
validation of large SoCs integrating IP blocks from multiple vendors. Global, social, and economical implications of Electronic System and
Design Quality. Emerging standards and regulations influencing system quality.