The 20th Annual IEEE/SEMI® Advanced Semiconductor Manufacturing Conference (ASMC 2009)
May 10-12, 2009 -- Berlin, Germany

ASMC, now in its 20th year, fills a critical need in our industry by providing the opportunity and the venue for technical managers, hands-on engineers, and other semiconductor industry professionals to network, learn, and share knowledge on new and best-method semiconductor manufacturing practices and concepts. With the dynamic nature of our industry, information sharing across sectors is a vital aspect of innovation and continuous improvement. This shared knowledge continues at ASMC 2009.
Call for Papers topics

SEMI® and IEEE are now soliciting technical abstracts on a range of fab performance issues:

* Advanced Metrology
* Advanced Processes and Materials
* Advanced Process Control
* Analog, High Power and High Voltage
* Contamination Free Manufacturing (CFM)
* Cost Effectiveness and Manufacturing Efficiency
* Defect Inspection and Reduction
* Design for Manufacturability (DFM)
* Enabling Technologies and Innovative Devices
* Equipment Reliability and Productivity
* Factory Automation and Dynamics
* Industrial Engineering
* Lithography Advances/Challenges
* Wafer Level Packaging
* Yield Enhancement and Yield Modeling

Contact Us

For further conference information and details about sponsorship opportunities, please contact Margaret Kindling, SEMI senior program manager, mkindling@semi.org, or call 1.202.289.0440. To order the CD-ROM of the ASMC 2008 technical proceedings, please contact SEMI customer service at 1.408.943.6901.
Committee

Our special appreciation to the ASMC committee members who volunteer countless hours in support of ASMC.


ASMC 2009 Conference Co-chairmen:
Walter Schoenleber, Applied Materials
Brett Williams, ON Semiconductor
Steering and Technical Committee:

Jeff Barnum, KLA-Tencor Corp.
Thomas Beeg, Qimonda
Jennifer Braggin, Entegris (IMEC assignee)
Duane Boning, PhD., MIT - Dept. of EE&CS
Thomas Carbone, Fairchild Semiconductor
John Conway, Intel Corporation
Russell Dover, KLA-Tencor
Eric T. Eisenbraun, PhD., University at Albany
Eric Englhardt, Applied Materials
José Estabil, Massachusetts Institute of Technology
Pascal Etman, Eindhoven University of Technology
Patrice Flack, PhD., Integrated Materials, Inc.
Ahmad Fathulla, PhD., Infineon Technologies Villach
Rainer Gehres, IBM Systems & Technology Group
John Goodman, Entegris, Inc.
Nirmal Govind, PhD., Intel Corporation
Gary Green, Synopsys, Inc.
Dave Gross. Advanced Micro Devices
Christopher Hess, PDF Solutions, Inc.
Dick James, Chipworks Inc.
Greg Klusewitz, Fairchild Semiconductor
Chris Konarski, IBM Microelectronics
Scott Lantz, Intel Corporation
Steven Leibiger, Fairchild Semiconductor Corporation
Holly Magoon, Nikon Precision, Inc.
Daniel Maynard, IBM Microelectronics
Scott McClure, IBM Systems & Technology Group
Graham McFarlane, Linde Electronics
Mike McIntyre, Advanced Micro Devices
Winfried Meier, Nikon Precision Europe GmbH
Hanno Melzner, Infineon Technologies AG
William Miller, IBM Microelectronics
Kevin Nason, Fairchild Semiconductor
Mark Nelson, ON Semiconductor
Kazunori Nemoto, Ph.D., Hitachi High Technologies
Oliver D. Patterson, PhD, IBM Microelectronics
Thomas Piliszczuk PhD., KLA-Tencor France
Larry Pulvirent, Freescale Semiconductor
Dieter Rathei, D R YIELD software & solutions
Ron Remke, International SEMATECH
Theresa Roeder, PhD., San Francisco State University
Leonard Rubin, Ph.D., Axcelis Technologies, Inc.
Walter Schoenleber, Applied Materials
Arthur Tay, PhD., National University of Singapore
Thuy Tran-Quinn, NXP Semiconductors
Helmuth Treichel, Xyratex
William Tyler, FSI International
Jacek Tyminski, PhD., Nikon Precision Inc.
Peter van der Meulen, BlueShift Technologies
Paul Werbaneth , Tegal Corp.
Brett Williams, ON Semiconductor
Kenny Ye, PhD., Hitachi High Technologies America