posted by system || 2339 views || tracked by 2 users: [display]

EDAPS 2008 : Electrical Design of Advanced Packaging and Systems Symposium

FacebookTwitterLinkedInGoogle

Link: http://www.edaps2008.org/Contents/Callforpaper.asp%20globalmenu=5&localmenu=1
 
When Dec 10, 2008 - Dec 12, 2008
Where Seoul, South Korea
Submission Deadline Jul 31, 2008
Categories    manufacturing
 

Call For Papers

[Empty]

Related Resources

ICAUAS 2025   2025 International Conference on Advanced Unmanned Aerial Systems (ICAUAS 2025)
IJCACS 2025   International Journal of Control, Automation, Communication and Systems
AMEE--EI 2025   2025 8th International Conference on Advanced Mechanical and Electrical Engineering (AMEE 2025)
MSEJ 2025   Advances in Materials Science and Engineering: An International Journal
ICCSD--EI 2025   2025 6th International Conference on Circuits, Systems and Devices (ICCSD 2025)
EI/Scopus-BDCTA 2025   2025 International Conference on Big Data, Communication Technology and Computer Applications-EI/Scopus
VALID 2025   The Seventeenth International Conference on Advances in System Testing and Validation Lifecycle
AIRC 2025   IEEE--2025 6th International Conference on Artificial Intelligence, Robotics, and Control (AIRC 2025)
AMEE 2025   2025 8th International Conference on Advanced Mechanical and Electrical Engineering (AMEE 2025)
IEAI 2025   2025 6th International Conference on Industrial Engineering and Artificial Intelligence (IEAI 2025)