posted by system || 2854 views || tracked by 2 users: [display]

EDAPS 2008 : Electrical Design of Advanced Packaging and Systems Symposium

FacebookTwitterLinkedInGoogle

Link: http://www.edaps2008.org/Contents/Callforpaper.asp%20globalmenu=5&localmenu=1
 
When Dec 10, 2008 - Dec 12, 2008
Where Seoul, South Korea
Submission Deadline Jul 31, 2008
Categories    manufacturing
 

Call For Papers

[Empty]

Related Resources

ETTIS 2026   6th International Conference on Emerging Trends and Technologies on Intelligent Systems
ICAISM 2026   2026 2nd International Conference on Artificial Intelligence and Smart Manufacturing-EI/Scopus
Transition Design Conference 2026   Transition Design Conference 2026: Weaving Regenerative Futures
ICCRT 2026   2026 4th International Conference on Control and Robot Technology (ICCRT 2026)
Digitalization of Financial Systems 2026   Digitalization of Financial Systems: Ethical Implications and Sustainable Development Perspective
HCIML 2026   2026 International Conference on Human-Computer Interaction and Machine Learning-EI/Scopus
Springer ICMIM 2026   Springer--2026 The 8th International Conference on Materials and Intelligent Manufacturing (ICMIM 2026)
AIII 2026   2026 International Conference on Artificial Intelligence and Industrial Internet
ICoAIM 2026   2026 International Conference on Aerospace and Intelligent Manufacturing-EI/Scopus
CSACN 2026   2026 International Conference on Communication System and Communication Network-EI/Scopus