posted by system || 2037 views || tracked by 2 users: [display]

IMPACT 2008 : 3rd Intl. Microsystems, Packaging, Assembly & Circuits Technology Conf.

FacebookTwitterLinkedInGoogle

Link: http://www.impact-emap.org/2008/CallPaper/
 
When Oct 22, 2008 - Oct 24, 2008
Where Taipei, Taiwan
Submission Deadline May 31, 2008
Categories    manufacturing
 

Call For Papers

[Empty]

Related Resources

InterPACK 2024   International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
MSEJ 2024   Advances in Materials Science and Engineering: An International Journal
IEEE-Ei/Scopus-ACEPE 2024   2024 IEEE Asia Conference on Advances in Electrical and Power Engineering (ACEPE 2024) -Ei Compendex
MSEJ 2024   Advances in Materials Science and Engineering: An International Journal
ICoSR 2025   2025 4th International Conference on Service Robotics
AIRC 2025   IEEE--2025 6th International Conference on Artificial Intelligence, Robotics, and Control (AIRC 2025)
TRS 2025   Transportation Research Symposium
EI/Scopus-IAR 2024   2024 International Academic Conference on Industrial Automation and Robotics 2024 (IAR 2024) -EI Compendex/Scopus
IMCOM 2025   19th International Conference on Ubiquitous Information Management and Communication
AP-EduTeach 2025   7th Asia-Pacific Conference on Education, Teaching & Technology 2025