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ETS 2013 : IEEE European Test SymposiumConference Series : European Test Symposium | |||||||||||||||
Link: http://www.lirmm.fr/ETS13 | |||||||||||||||
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Call For Papers | |||||||||||||||
The areas of interest include (but are not limited to) the following topics.
•Analog Test •ATE Hardware and Software •Automatic Test Generation •Board Test and Diagnosis •Boundary Scan Test •Built-In Self Test (BIST) •Current-Based Test •Defect-Based Test •Delay and Performance Test •Dependability •Design for Test(ability) – DfT •Design Verification and Validation •Diagnosis and Debug •Economics of Test •Failure Analysis •Fault Modeling and Simulation •Fault Tolerance •High-Speed I/0 Test •Low-Power IC Test •Memory Test and Repair •MEMS Test •Microprocessor Test •Mixed-Signal Test •Nanotechnology Test •On-line Test •Power Issues in Test •Reliability •RF Test •Self-Repair •Signal Integrity Test •Stacked IC Test •Standards in Test •System Test •System-in-Package (SiP) Test •System-on-Chip (SoC) Test •Soft Errors •Test(ability) Synthesis •Test of Reconfigurable Systems •Test Quality •Thermal Issues in Test •Transient and Soft Errors •Yield Analysis and Enhancement |
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