The 26th European Microelectronics & Packaging Conference (EMPC 2027) will take place from September 14–16, 2027 in Ingolstadt, Germany.

EMPC 2027 seeks original, non-commercial contributions presenting research and innovations in all areas of electronics packaging and system integration. Authors are invited to submit abstracts describing recent work, clearly outlining the objectives and demonstrating new results.

Conference topics include:

Design, Modelling and Simulation
• RF and Microwave
• Thermal and Thermomechanical
• Manufacturability and Testability
• Electronic/Photonic Co-Integration
• 2.5D and 3D Packages
• Chiplets

Materials and Processes
• Substrate and Interposer Technologies
• Interconnect Materials and Technologies
• Assembly and Manufacturing
• Material Characterisation
• Nanomaterials and Nanotechnologies

Advanced Packaging and System Integration
• Heterogeneous Integration
• 2.5D and 3D Packaging
• System in Package
• Wafer Level Packaging
• Photonics and Co-Packaged Optics
• MEMS, MOEMS and Sensor Packaging
• RF Packaging
• Power Packaging

Quality and Reliability
• Process Control
• Inspection and Testing
• Reliability Testing
• Digital Twins
• Failure Analysis
• Lifetime Prediction
• Long-Term Storage

Emerging Technologies
• Packaging for AI and HPC
• Quantum Devices and Applications
• Sustainable Electronics and Circular Economy
• Glass Interposer Technology
• Use of AI in Electronics Technology

Abstract submission deadline: January 25, 2027

Maximum abstract length: 500 words. The upload of up to two figures is optional.

Accepted contributions will be published in the conference proceedings and archived in IEEE Xplore, provided they comply with the required specifications, as well as in IMAPSource.

More information:
https://empc2027.org/submissions/