2026 International Conference on Artificial Intelligence and Design (AID 2026) will be held in Seoul, South Korea from July 17 to 19, 2026.

𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗪𝗲𝗯𝘀𝗶𝘁𝗲: https://ais.cn/u/2iuUVn

---𝗖𝗮𝗹𝗹 𝗳𝗼𝗿 𝗽𝗮𝗽𝗲𝗿𝘀---
The topics of interest for submission include, but are not limited to:
◕Track 1: AI Methods and Computational Design
- Deep Learning Methods
- Generative Models
- Knowledge Representation and Reasoning
- Computational Intelligence
- Design Optimization
- Data-Driven Design
- Pattern Recognition
- Explainable AI
- Decision Support Systems
- Machine Learning for Design

◕Track 2: Human-AI Interaction and Intelligent Interfaces
- Human-AI Interaction
- Intelligent User Interfaces
- Human-Centered AI
- Adaptive Interfaces
- Personalization and Recommendation
Conversational Interfaces
- Collaborative Systems
- User Modeling
- Usability Evaluation
- Interactive Design Systems

◕Track 3: Design Automation and Creative Applications
- Generative Design
- Design Automation
- Computational Creativity
- Product Design Applications
- Industrial Design Systems
- Concept Generation
- Digital Prototyping
- Visual Computing for Design
- Smart Design Tools
- AI for Creative Practice

◕Track 4: Applied AI in Design and Emerging Issues
- Urban Computing
- Service Design Systems
- Sustainable Design
- Responsible AI
- Trustworthy Intelligent Systems
- Design Informatics
- Emerging Design Applications

---𝗣𝘂𝗯𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻---
All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted and presented papers will be published in the ACM ICPS (ACM International Conference Proceeding Series). The proceedings will be submitted to indexing databases, such as EI Compendex and Scopus, subject to their scope and acceptance criteria.

---𝗜𝗺𝗽𝗼𝗿𝘁𝗮𝗻𝘁 𝗗𝗮𝘁𝗲𝘀---
Submission Deadline: June 30, 2026
Registration Deadline: July 2, 2026
Final Paper Submission Date: July 2, 2026
Conference Dates: July 17-19, 2026

--- 𝗣𝗮𝗽𝗲𝗿 𝗦𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻---
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/2iuUVn